Display device

ABSTRACT

A display device includes: a first substrate including sub-pixels including light emitting areas; first electrodes and second electrodes disposed on the first substrate and spaced apart from each other; light emitting elements disposed on the first substrate and disposed on the first electrodes and the second electrodes in the light emitting areas of the sub-pixels; a color control member disposed on the light emitting elements and including light transmitting layers and wavelength conversion layers; a second substrate facing the first substrate and including light transmitting areas overlapping the sub-pixels; color filter layers disposed on a surface of the second substrate facing the first substrate; and a base layer disposed between the first substrate and the second substrate and disposed between at least the wavelength conversion layers and the color filter layers.

CROSS REFERENCE TO RELATED APPLICATION(S)

This application is a national entry of International Application No.PCT/KR2021/008369, filed on Jul. 1, 2021, which claims under 35 U.S.C.§§ 119(a) and 365 (b) priority to and benefits of Korean PatentApplication No. 10-2020-0099389, filed on Aug. 7, 2020, in the KoreanIntellectual Property Office (KIPO), the entire content of which areincorporated herein by reference.

BACKGROUND 1. Technical Field

Embodiments relate to a display device.

2. Description of the Related Art

The importance of display devices has steadily increased with thedevelopment of multimedia technology. Various types of display devicessuch as an organic light emitting display (OLED), a liquid crystaldisplay (LCD) and the like have been used.

A display device is a device for displaying an image, and includes adisplay panel, such as an organic light emitting display panel or aliquid crystal display panel. The light emitting display panel mayinclude light emitting elements, e.g., light emitting diodes (LED), andexamples of the light emitting diode include an organic light emittingdiode (OLED) formed of an organic material as a fluorescent material andan inorganic light emitting diode formed of an inorganic material as afluorescent material.

SUMMARY

Embodiments provide a display device capable of improving lightconversion efficiency and color matching rate.

However, embodiments of the disclosure are not limited to those setforth herein. The above and other embodiments will become more apparentto one of ordinary skill in the art to which the disclosure pertains byreferencing the detailed description of the disclosure given below.

According to an embodiment, a display device may include: a firstsubstrate including a plurality of sub-pixels including light emittingareas, a plurality of first electrodes and a plurality of secondelectrodes disposed on the first substrate and spaced apart from eachother, a plurality of light emitting elements disposed on the firstsubstrate and disposed on the plurality of first electrodes and theplurality of second electrodes in the light emitting areas of theplurality of sub-pixels, a color control member disposed on theplurality of light emitting elements and including a plurality of lighttransmitting layers and a plurality of wavelength conversion layers, asecond substrate facing the first substrate and including a plurality oflight transmitting areas overlapping the plurality of sub-pixels, aplurality of color filter layers disposed on a surface of the secondsubstrate facing the first substrate, and a base layer disposed betweenthe first substrate and the second substrate and disposed between atleast the plurality of wavelength conversion layers and the plurality ofcolor filter layers.

The plurality of light emitting elements may include first lightemitting elements disposed in a first sub-pixel and second lightemitting elements disposed in a second sub-pixel, the color controlmember may include a light transmitting layer disposed on the firstlight emitting elements and a first wavelength conversion layer disposedon the second light emitting elements, and the plurality of color filterlayers may include a first color filter layer disposed on the lighttransmitting layer and a second color filter layer disposed on the firstwavelength conversion layer.

The light transmitting layer may be directly disposed on the first lightemitting elements, the first wavelength conversion layer may be directlydisposed on the second light emitting elements, and the base layer maybe disposed between the light transmitting layer and the first colorfilter layer.

The display device may further include a first capping layer disposed onthe light transmitting layer and the first wavelength conversion layer,and a second capping layer disposed on a surface of the first colorfilter layer and a surface of the second color filter layer facing thefirst substrate, wherein the base layer may be in direct contact withthe first capping layer and the second capping layer.

The base layer may include a low refractive material having a refractiveindex lower than a refractive index of the first capping layer, and thedisplay device may further include a spacer disposed at a boundary areabetween some of the plurality of sub-pixels and disposed between thefirst substrate and the second substrate.

The spacer may be in direct contact with the first capping layer and thesecond capping layer.

The light transmitting layer may be disposed on a surface of the firstcolor filter layer facing the first substrate, and the base layer may bedisposed between the light transmitting layer and the first lightemitting elements.

The display device may further include a third capping layer disposed ona surface of the light transmitting layer facing the first substrate.

The plurality of light emitting elements may emit light of a firstcolor, and the first wavelength conversion layer may convert the lightof the first color emitted from the plurality of light emitting elementsinto light of a second color different from the first color.

The plurality of light emitting elements may further include third lightemitting elements disposed in a third sub-pixel, the color controlmember may further include a second wavelength conversion layer directlydisposed on the third light emitting elements, the color filter layersmay further include a third color filter layer disposed on the secondwavelength conversion layer, and the second wavelength conversion layermay convert the light emitted from the third light emitting elementsinto light of a third color different from the first color and thesecond color.

The display device may further include a plurality of first banksdisposed in boundary areas between the plurality of sub-pixels anddisposed and spaced apart from each other in the light emitting areasand a second bank disposed at the boundary areas between the pluralityof sub-pixels and partially disposed on the plurality of first banks,wherein the plurality of first electrodes and the plurality of secondelectrodes may be disposed on different first banks, respectively.

The display device may further include a first light blocking memberdisposed between the plurality of light transmitting layers and theplurality of wavelength conversion layers and a second light blockingmember disposed on the surface of the second substrate and disposedbetween the color filter layers, wherein the first light blocking memberand the second light blocking member may overlap the second bank in athickness direction.

The display device may further include a third bank disposed on thesecond bank and a first capping layer disposed on the third bank and thecolor control members.

The display device may further include a first insulating layer disposedon the plurality of first electrodes and the plurality of secondelectrodes, a first contact electrode in contact with end portions ofthe plurality of light emitting elements and the plurality of firstelectrodes, and a second contact electrode in contact with other endportions of the plurality of light emitting elements and the pluralityof second electrodes, wherein the plurality of light emitting elementsmay be directly disposed on the first insulating layer.

According to an embodiment, a display device may include: a firstsubstrate including a plurality of sub-pixels including light emittingareas, the plurality of sub-pixels including a first sub-pixel and asecond sub-pixel, a first electrode and a second electrode disposed ineach of the plurality of sub-pixels on the first substrate and spacedapart from each other, first light emitting elements disposed on thefirst electrode and the second electrode of the first sub-pixel andsecond light emitting elements disposed on the first electrode and thesecond electrode of the second sub-pixel, a light transmitting layerdirectly disposed on the first light emitting elements and a firstwavelength conversion layer directly disposed on the second lightemitting elements, a first capping layer covering the light transmittinglayer and the first wavelength conversion layer, a second substratefacing the first substrate and including a first light transmitting areaoverlapping the first sub-pixel and a second light transmitting areaoverlapping the second sub-pixel, a first light blocking member disposedon a surface of the second substrate facing the first substrate anddisposed between the first light transmitting area and the second lighttransmitting area, a first color filter layer disposed on the surface ofthe second substrate in the first light transmitting area and a secondcolor filter layer disposed on the surface of the second substrate inthe second light transmitting area, a second capping layer covering thefirst color filter layer, the second color filter layer, and the lightblocking member, and a base layer disposed between the first cappinglayer and the second capping layer.

The display device may further include a plurality of first banksdisposed in adjacent sub-pixels on the first substrate and spaced apartfrom each other in the light emitting areas and a second bank disposedat a boundary area between the adjacent sub-pixels and surrounding thelight emitting areas, wherein the light transmitting layer and the firstwavelength conversion layer may be disposed in areas surrounded by thesecond bank.

The first capping layer may be directly disposed on the second bank.

The display device may further include a second light blocking memberdirectly disposed on a portion of the first capping layer disposed onthe second bank and disposed between the light transmitting layer andthe first wavelength conversion layer.

The second bank and the first light blocking member may overlap eachother in a thickness direction.

The base layer may include a low refractive material having a refractiveindex lower than a refractive index of the first capping layer, and thedisplay device may further include a spacer disposed at a boundary areabetween some of the plurality of sub-pixels and disposed to be in directcontact with the first capping layer and the second capping layerbetween the first substrate and the second substrate.

In a display device according to an embodiment, a light emitting displaydevice may be implemented to include a display substrate on which lightemitting elements and a color control member are disposed and a colorfilter substrate on which a color filter layer is disposed. In thedisplay device, the light emitting elements and the color control membermay be disposed adjacent to each other on the same substrate, andaccordingly, emission efficiency and a color gamut may be excellent.

In the display device according to an embodiment, the color controlmember may be manufactured on a substrate different from that of thecolor filter layer. Thus, the color control member may be protected frombeing damaged in a thermal process for forming the color filter layer.

The effects according to the embodiments are not limited by the contentsdescribed above, and more various effects are included in thisdisclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of a display device according to anembodiment;

FIG. 2 is a schematic plan view illustrating a pixel of a first displaysubstrate according to an embodiment;

FIG. 3 is a schematic plan view illustrating a pixel of a second displaysubstrate according to an embodiment;

FIG. 4 is a schematic cross-sectional view illustrating a pixel of thedisplay device according to an embodiment;

FIG. 5 is a schematic cross-sectional view taken along lines Q1-Q1′,Q2-Q2′, and Q3-Q3′ of FIG. 2 ;

FIG. 6 is a schematic view of a light emitting element according to anembodiment;

FIGS. 7 to 17 are schematic cross-sectional views sequentiallyillustrating processes of manufacturing the display device according toan embodiment;

FIG. 18 is a schematic cross-sectional view illustrating a pixel of adisplay device according to an embodiment;

FIG. 19 is a schematic cross-sectional view illustrating a pixel of adisplay device according to an embodiment;

FIGS. 20 to 22 are schematic cross-sectional views sequentiallyillustrating some of processes of manufacturing the display device ofFIG. 19 ;

FIG. 23 is a schematic plan view illustrating a pixel of a first displaysubstrate according to an embodiment;

FIG. 24 is a schematic plan view illustrating a pixel of a first displaysubstrate according to an embodiment;

FIG. 25 is a schematic cross-sectional view illustrating a pixel of adisplay device according to an embodiment;

FIGS. 26 and 27 are schematic cross-sectional views sequentiallyillustrating some of processes of manufacturing the display device ofFIG. 25 ; and

FIGS. 28 and 29 are schematic cross-sectional views illustrating a pixelof a display device according to an embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods disclosed herein. It is apparent, however, that variousembodiments may be practiced without these specific details or with oneor more equivalent arrangements. Here, various embodiments do not haveto be exclusive nor limit the disclosure. For example, specific shapes,configurations, and characteristics of an embodiment may be used orimplemented in another embodiment.

Unless otherwise specified, the illustrated embodiments are to beunderstood as providing features of the invention. Therefore, unlessotherwise specified, the features, components, modules, layers, films,panels, regions, and/or aspects, etc. (hereinafter individually orcollectively referred to as “elements”), of the various embodiments maybe otherwise combined, separated, interchanged, and/or rearrangedwithout departing from the invention.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the DR1-axis, theDR2-axis, and the DR3-axis are not limited to three axes of arectangular coordinate system, such as the X, Y, and Z—axes, and may beinterpreted in a broader sense. For example, the DR1-axis, the DR2-axis,and the DR3-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another. Further,the X-axis, the Y-axis, and the Z-axis are not limited to three axes ofa rectangular coordinate system, such as the x, y, and z axes, and maybe interpreted in a broader sense. For example, the X-axis, the Y-axis,and the Z-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another. For thepurposes of this disclosure, “at least one of A and B” may be construedas understood to mean A only, B only, or any combination of A and B.Also, “at least one of X, Y, and Z” and “at least one selected from thegroup consisting of X, Y, and Z” may be construed as X only, Y only, Zonly, or any combination of two or more of X, Y, and Z. As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the term“below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise.

Moreover, the terms “comprises,” “comprising,” “includes,” and/or“including,” when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, components,and/or groups thereof, but do not preclude the presence or addition ofone or more other features, integers, steps, operations, elements,components, and/or groups thereof. It is also noted that, as usedherein, the terms “substantially,” “about,” and other similar terms, areused as terms of approximation and not as terms of degree, and, as such,are utilized to account for inherent deviations in measured, calculated,and/or provided values that would be recognized by one of ordinary skillin the art.

Various embodiments are described herein with reference to sectionaland/or exploded illustrations that are schematic illustrations ofembodiments and/or intermediate structures.

As such, variations from the shapes of the illustrations as a result,for example, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments disclosed herein should not necessarily beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. In this manner, regions illustrated in the drawings maybe schematic in nature and the shapes of these regions may not reflectactual shapes of regions of a device and, as such, are not necessarilyintended to be limiting.

Hereinafter, embodiments will be described with reference to theaccompanying drawings.

FIG. 1 is a schematic plan view of a display device according to anembodiment.

Referring to FIG. 1 , a display device 10 may display a moving image ora still image. The display device 10 may include all electronic devicesthat provide display screens. For example, the display device 10 mayinclude televisions, laptop computers, monitors, billboards, theInternet of Things (IoT), mobile phones, smartphones, tablet personalcomputers (PCs), electronic watches, smart watches, watch phones, headmounted displays, mobile communication terminals, electronic notebooks,electronic books, portable multimedia players (PMPs), navigationdevices, game machines, digital cameras, camcorders, and the like, whichprovide display screens.

The display device 10 may include a display panel providing the displayscreen. Examples of the display panel may include an inorganic lightemitting diode display panel, an organic light emitting display panel, aquantum dot light emitting display panel, a plasma display panel, afield emission display panel, and the like. Hereinafter, a case where aninorganic light emitting diode display panel is applied as an example ofthe display panel will be described as an example, but embodiments arenot limited thereto.

A shape of the display device 10 may be variously modified. For example,the display device 10 may have a shape such as a rectangular shape witha width greater than a length, a rectangular shape with a length greaterthan a width, a square shape, a rectangular shape with rounded corners(e.g., vertices), other polygonal shapes, or a circular shape. A shapeof a display area DPA of the display device 10 may also be similar to anoverall shape of the display device 10. In FIG. 1 , the display device10 and the display area DPA having the rectangular shape with the widthgreater than the length are illustrated.

The display device 10 may include the display area DPA and non-displayareas NDA. The display area DPA may be an area in which a screen may bedisplayed, and the non-display area NDA may be an area in which thescreen is not displayed. The display area DPA may also be referred to asan active area, and the non-display area NDA may also be referred to asa non-active area. The display area DPA may cover the center area of thedisplay device 10.

The display area DPA may include pixels PX. The pixels PX may bearranged in a matrix pattern. A shape of each pixel PX may be arectangular shape or a square shape in plan view, but embodiment are notlimited thereto, and may also be a rhombic shape of which each side isinclined with respect to a direction. For example, each of the pixels PXmay include one or more light emitting elements ED emitting light of aspecific wavelength band to display a specific color.

The non-display areas NDA may be disposed around the display area DPA.The non-display areas NDA may entirely or partially surround the displayarea DPA. The display area DPA may have a rectangular shape, and thenon-display areas NDA may be disposed adjacent to four sides of thedisplay area DPA. The non-display areas NDA may include a bezel of thedisplay device 10. Lines or circuit drivers included in the displaydevice 10 may be disposed, or external devices may be mounted, in eachof the non-display areas NDA.

FIG. 2 is a schematic plan view illustrating a pixel of a first displaysubstrate according to an embodiment. FIG. 3 is a schematic plan viewillustrating a pixel of a second display substrate according to anembodiment. FIG. 4 is a schematic cross-sectional view illustrating apixel of the display device according to an embodiment. FIG. 5 is across-sectional view taken along lines Q1-Q1′, Q2-Q2′, and Q3-Q3′ ofFIG. 2 .

FIG. 2 illustrates a schematic layout of light emitting elements ED andcolor control members TPL, WCL1, and WCL2 based on a second bank BNL2disposed in a first display substrate 100 of the display device 10, andFIG. 3 illustrates a schematic layout of a second light blocking memberBM2 and a color filter layer CFL (e.g., CFL1, CFL2, and CFL3) disposedin a second display substrate 300. FIG. 4 illustrates a cross-section ofa pixel of the display device 10, and FIG. 5 illustrates cross-sectionsof the first display substrate 100 and the second display substrate 300take along lines Q1-Q1′, Q2-Q2′, and Q3-Q3′ of FIG. 2 .

Referring to FIGS. 2 to 5 , each of the pixels PX may include sub-pixelsPXn (here, n is an integer of 1 to 3). For example, a pixel PX mayinclude a first sub-pixel PX1, a second sub-pixel PX2, and a thirdsub-pixel PX3. The first sub-pixel PX1 may display light of a firstcolor, the second sub-pixel PX2 may display light of a second color, andthe third sub-pixel PX3 may display light of a third color. The firstcolor may be blue, the second color may be green, and the third colormay be red. However, embodiments are not limited thereto. It isillustrated in FIGS. 2 and 3 that the pixel PX includes three sub-pixelsPXn, but embodiments are not limited thereto, and the pixel PX mayinclude a larger number of sub-pixels PXn.

According to an embodiment, the display device 10 may include the firstdisplay substrate 100 and the second display substrate 300 disposed toface each other. The first display substrate 100 may include lightemitting elements ED (e.g., ED1, ED2, and ED3) and color control membersTPL, WCL1, and WCL2 disposed on a first substrate SUB1, and the seconddisplay substrate 300 may include a color filter layer CFL disposed on asurface of a second substrate SUB2. The light emitting elements ED mayemit light of specific wavelength bands, and the light emitted from thelight emitting elements ED may pass through the color control membersTPL, WCL1, and WCL2 and the color filter layer CFL and be emittedthrough another surface of the second substrate SUB2.

The first display substrate 100 may include light emitting areas EMA andnon-light emitting areas NEA The light emitting area EMA may be an areain which the light emitting elements ED are disposed to emit light of aspecific wavelength band, and the non-light emitting area NEA may be anarea in which the light emitting elements are not disposed and the lightdoes not transmit and thus, is not emitted.

For example, each sub-pixel PXn may include a sub-area CBA disposed on aside of the light emitting area EMA in a second direction DR2. Thesub-area CBA may be disposed between light emitting areas EMA ofsub-pixels PXn neighboring to each other in the second direction DR2.For example, light emitting areas EMA and sub-areas CBA may be arrangedin the first display substrate 100. For example, the light emittingareas EMA and sub-areas CBA may be repeatedly arranged in a firstdirection DR1, respectively, and the light emitting areas EMA and thesub-areas CBA may be alternately arranged in the second direction DR2The second bank BNL2 may be disposed between the sub-areas CBA and thelight emitting areas EMA, and distances between the sub-areas CBA andthe light emitting areas EMA may change according to a width of thesecond bank BNL2. Light may not be emitted in the sub-areas CBA as thelight emitting elements ED are not disposed in the sub-areas CBA, butportions of electrodes RME1 and RME2 of the first display substrate 100may be disposed in the sub-areas CBA. The electrodes RME1 and RME2disposed for some sub-pixels PXn may be separated from each other in thesub-area CBA. However, embodiments are not limited thereto, and therespective electrodes RME1 and RME2 may be disposed in a state in whichthey are not separated from the sub-area CBA

The first display substrate 100 will be described in detail. The firstsubstrate SUB1 may be an insulating substrate. The first substrate SUB1may be made of a transparent insulating material such as glass, quartz,or a polymer resin. For example, the first substrate SUB1 may be a rigidsubstrate, but may also be a flexible substrate that is bendable,foldable, or rollable.

A circuit layer CCL may be disposed on the first substrate SUB1. Thecircuit layer CCL may include a lower metal layer, a semiconductorlayer, a first gate conductive layer, a first conductive layer, and asecond conductive layer, and interlayer insulating layers each disposedbetween these layers. It is illustrated in the drawing that a singlefirst transistor T1 and storage capacitor and some lines are disposed inthe circuit layer CCL, but embodiments are not limited thereto. Thecircuit layer CCL of the display device 10 may include a larger numberof transistors in addition to the first transistor T1 by including morelines, electrodes, and semiconductor layers. For example, the displaydevice 10 may also include two or three transistors by including one ormore transistors in addition to the first transistor T1 for eachsub-pixel PXn.

A lower metal layer BML may be disposed on the first substrate SUB1. Thelower metal layer BNL may overlap an active layer ACT1 of the firsttransistor T1 of the display device 10. The lower metal layer BML mayinclude a material blocking light to prevent the light from beingincident on the active layer ACT1 of the first transistor. As anexample, the lower metal layer BML may be made of an opaque metalmaterial blocking transmission of the light. However, embodiments arenot limited thereto, and in some cases, the lower metal layer BML may beomitted.

A buffer layer BL may be entirely disposed on the lower metal layer andthe first substrate SUB1. For example, the buffer layer BL may coverupper surfaces of the lower metal layer BML and the first substrateSUB1. The buffer layer BL may be formed on the first substrate SUB1 inorder to protect the first transistors T1 of the pixels PX from moisturepermeating through the first substrate SUB1 vulnerable to moisturepermeation, and may perform a surface planarization function.

The semiconductor layer may be disposed on the buffer layer BL Thesemiconductor layer may include the active layer ACT1 of the firsttransistor T1. The active layer ACT1 may partially overlap a gateelectrode G1 or the like of a first gate conductive layer to bedescribed below.

In an embodiment, the semiconductor layer may include polycrystallinesilicon, single crystal silicon, an oxide semiconductor, or the like. Incase that the semiconductor layer includes the oxide semiconductor, eachactive layer ACT1 may include conductive regions ACT_a and ACT_b and achannel region ACT_c between the conductive regions ACT_a and ACT_b. Theoxide semiconductor may be an oxide semiconductor containing indium(In).

In some embodiments, the oxide semiconductor may be indium tin oxide(ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium zinctin oxide (IZTO), indium gallium zinc oxide (IGZO), indium gallium tinoxide (IGTO), indium gallium zinc tin oxide (IGZTO), or the like.

In another example, the semiconductor layer may include polycrystallinesilicon. The polycrystalline silicon may be formed by crystallizingamorphous silicon. For example, each of the conductive regions of theactive layer ACT1 may be a doped region doped with impurities.

A first gate insulating layer G1 may be disposed on the semiconductorlayer and the buffer layer BL. For example, the first gate insulatinglayer G1 may cover upper surfaces of the semiconductor layer and thebuffer layer BL. The first gate insulating layer G1 may function as agate insulating film of each of the transistors.

The first gate conductive layer may be disposed on the first gateinsulating layer G1. The first gate conductive layer may include a gateelectrode G1 of the first transistor T1 and a first capacitanceelectrode CSE1 of a storage capacitor. The gate electrode G1 may overlapthe channel region ACT_c of the active layer ACT1 in a thicknessdirection. The first capacitance electrode CSE1 may overlap a secondcapacitance electrode CSE2 to be described below in the thicknessdirection. In some embodiments, the first capacitance electrode CSE1 maybe connected to and may be integral with the gate electrode G1. Thefirst capacitance electrode CSE1 may overlap the second capacitanceelectrode CSE2 in the thickness direction, and the storage capacitor maybe formed between the first capacitance electrode CSE1 and the secondcapacitance electrode CSE2.

The first gate conductive layer may be formed as a single layer ormultiple layers made of any one of molybdenum (Mo), aluminum (Al),chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd),and copper (Cu), or alloys thereof. However, embodiments are not limitedthereto.

A first interlayer insulating layer IL1 may be disposed on the firstgate conductive layer. The first interlayer insulating layer IL1 maycover the first gate conductive layer, and may function to protect thefirst gate conductive layer.

The first conductive layer may be disposed on the first interlayerinsulating layer IL1. The first conductive layer may include a firstdrain electrode D1 and a first source electrode S1 of the firsttransistor T1, a data line DTL, and the second capacitance electrodeCSE2.

The first drain electrode D1 and the first source electrode S1 of thefirst transistor T1 may be in contact with the conductive regions ACT_aand ACT_b of the active layer ACT1, respectively, through contact holespenetrating through the first gate insulating layer G1. For example, thefirst source electrode S1 of the first transistor T1 may be connected(e.g., electrically connected) to the lower metal layer BML throughanother contact hole.

The data line DTL may apply a data signal to another transistor includedin the display device 10. For example, the data line DTL may beconnected to source/drain electrodes of another transistor to transfer asignal applied from the data line DTL.

The second capacitance electrode CSE2 may overlap the first capacitanceelectrode CSE1 in the thickness direction. In some embodiments, thesecond capacitance electrode CSE2 may be connected to and may beintegral with the first source electrode S1.

The first conductive layer may be formed as a single layer or multiplelayers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr),gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu),or alloys thereof. However, embodiments are not limited thereto.

A second interlayer insulating layer IL2 may be disposed on the firstconductive layer. The second interlayer insulating layer IL2 mayfunction as an insulating film between the first conductive layer andother layers disposed above the first conductive layer. For example, thesecond interlayer insulating layer IL2 may cover the first conductivelayer, and function to protect the first conductive layer.

The second conductive layer may be disposed on the second interlayerinsulating layer IL2 The second conductive layer may include a firstvoltage line VL1, a second voltage line VL2, and a first conductivepattern layer CDP. A high potential voltage (or a first source voltage)supplied to the first transistor T1 may be applied to the first voltageline VL1, and a low potential voltage (or a second source voltage)supplied to a second electrode RME2 may be applied to the second voltageline VL2. For example, an alignment signal necessary for aligning thelight emitting elements ED may be applied to the second voltage line VL2in processes of manufacturing the display device 10.

The first conductive pattern layer CDP may be connected to the secondcapacitance electrode CSE2 through a contact hole formed in the secondinterlayer insulating layer IL2. However, as described above, the secondcapacitance electrode CSE2 may be integral with the first sourceelectrode S1 of the first transistor T1, and the first conductivepattern layer CDP may be connected (e.g., electrically connected) to thefirst source electrode S1. The first conductive pattern layer CDP mayalso be in contact with a first electrode RME1 to be described below,and the first transistor T1 may transfer the first source voltageapplied from the first voltage line VL1 to the first electrode RME1through the first conductive pattern layer CDP. It is illustrated in thedrawing that the second conductive layer includes a second voltage lineVL2 and a first voltage line VL1, but embodiments are not limitedthereto. The second conductive layer may include a larger number offirst voltage lines VL1 and second voltage lines VL2.

The second conductive layer may be formed as a single layer or multiplelayers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr),gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu),or alloys thereof. However, embodiments are not limited thereto.

Each of the buffer layer BL, the first gate insulating layer G1, thefirst interlayer insulating layer IL1, and the second interlayerinsulating layer IL2 described above may be formed as a single layer orinorganic layers in which layers are stacked or the layers arealternately stacked. For example, each of the buffer layer BL, the firstgate insulating layer GI, the first interlayer insulating layer IL1, andthe second interlayer insulating layer IL2 may be formed as multiplelayers in which inorganic layers including at least one of silicon oxide(SiO_(x)), silicon nitride (SiN_(x)), and silicon oxynitride(SiO_(x)N_(y)) are alternately stacked or a double layer in whichsilicon oxide (SiO_(x)) and silicon nitride (SiN_(x)) are sequentiallystacked.

A third interlayer insulating layer IL3 may be disposed on the secondconductive layer. The third interlayer insulating layer IL3 may includean organic insulating material, for example, an organic material such aspolyimide (PI), and perform a surface planarization function. However,in some embodiments, the third interlayer insulating layer IL3 may beomitted.

The light emitting elements ED, first banks BNL1, and the second bankBNL2 may be disposed on the third interlayer insulating layer IL3. Thesecond bank BNL2 may be disposed at boundary areas between thesub-pixels PXn or disposed between the light emitting area EMA and thesub-area CBA, and the light emitting elements ED, electrodes RME1 andRME2, and contact electrode CNE1 and CNE2 may be disposed in an areasurrounded by the second bank BNL2.

First banks BNL1 may be disposed (e.g., directly disposed) on the thirdinterlayer insulating layer IL3. A first bank BNL1 may have a shapeextending in the first direction DR1, and may be disposed across othersub-pixels PXn neighboring to each other. For example, the first bankBNL1 may have a shape extending in the second direction DR2, and may bedisposed in the light emitting area EMA of each sub-pixel PXn so as notto be disposed in sub-pixels PXn neighboring to each sub-pixel PXn inthe second direction DR2. For example, each of the first banks BNL1 mayb have a certain width in the first direction DR1, such that a portionof each of the first banks BNL1 may be disposed in the light emittingarea EMA and another portion thereof may be disposed at a boundary areabetween the sub-pixel PXn neighboring to each other in the firstdirection DR1. For example, a length of each of the first banks BNL1measured in the second direction DR2 may be greater than a length of thelight emitting area EMA measured in the second direction DR2, such thata portion of each of the first banks BNL1 may overlap the second bankBNL2 in the non-light emitting area NEA.

According to an embodiment, first banks BNL1 may be disposed in a singlesub-pixel PXn. For example, in the single sub-pixel PXn, two first banksBNL1 may be partially disposed in the light emitting area EMA. The twofirst banks BNL1 may be spaced apart from each other in the firstdirection DR1. The light emitting elements ED may be disposed betweenthe first banks BNL1 spaced apart from each other in the first directionDR1. It is illustrated in the drawing that two first banks BNL1 aredisposed in the light emitting area EMA of each sub-pixel PXn to form anisland-shaped pattern over the entirety of the first display substrate100, but embodiments are not limited thereto. The number of first banksBNL1 disposed in the light emitting area EMA of each sub-pixel PXn maybe modified according to the number of electrodes RME1 and RME2 or anarrangement of the light emitting elements ED.

The first bank BNL1 may have a structure in which at least a portionthereof protrudes from an upper surface of the third interlayerinsulating layer IL3. The protruding portion of the first bank BNL1 mayhave inclined side surfaces, and the light emitted from the lightemitting elements ED may be reflected from the electrodes RME1 and RME2disposed on the first bank BNL1 and emitted in an upward direction(e.g., third direction DR3) of the third interlayer insulating layerIL3. The first bank BNL1 may function as a reflective wall reflectingthe light emitted from the light emitting elements ED toward the upwarddirection (e.g., third direction DR3) with providing an area in whichthe light emitting elements ED are disposed. The side surfaces of thefirst banks BNL1 may be inclined in a linear shape, but embodiments arenot limited thereto, and the first banks BNL1 may also have asemi-circular shape or a semi-elliptical shape with curved outersurfaces. The first banks BNL1 may include an organic insulatingmaterial such as polyimide (PI), but embodiments are not limitedthereto.

The electrodes RME1 and RME2 may have a shape extending in a direction,and are disposed in each sub-pixel PXn. The electrodes RME1 and RME2 mayhave a shape extending in the second direction DR2, and may be disposedin each sub-pixel PXn so as to be spaced apart from each other in thefirst direction DR1 or the second direction DR2.

For example, a first electrode RME1 and a second electrode RME2 spacedapart from the first electrode RME1 in the first direction DR1 may bedisposed in each sub-pixel PXn. Light emitting elements ED may bedisposed on the first electrode RME1 and the second electrode RME2.

However, embodiments are not limited thereto, and positions of theelectrodes RME1 and RME2 disposed in each sub-pixel PXn may changeaccording to the number of electrodes RME1 and RME2 or the number oflight emitting elements ED disposed in each sub-pixel PXn.

The first electrode RME1 and the second electrode RME2 may be disposedin the light emitting area EMA of each sub-pixel PXn, and portions ofthe first electrode RME1 and the second electrode RME2 may overlap thesecond bank BNL2 in the thickness direction beyond the light emittingarea EMA. The electrodes RME1 and RME2 may extend in the seconddirection DR2 within the sub-pixel PXn, and may be spaced apart fromelectrodes RME1 and RME2 of other sub-pixel PXn in the second directionDR2 in the light emitting area EMA or the sub-area CBA.

Such an arrangement of the electrodes RME1 and RME2 may be implementedby forming electrode lines extending in the second direction DR2,disposing the light emitting elements ED, and separating the electrodelines from each other in a subsequent process. The electrode lines maybe used to generate an electric field in the sub-pixel PXn in order toalign (or arrange) the light emitting elements ED in the processes ofmanufacturing the display device 10. The light emitting elements ED maybe jetted (e.g., injected or sprayed) onto the electrode lines throughan inkjet printing process, and in case that ink including the lightemitting element ED is jetted onto the electrode lines, an alignmentsignal may be applied to the electrode lines to generate an electricfield. The light emitting element ED may be disposed on the electrodesby the electric field formed between the electrode lines. The lightemitting elements ED dispersed in the ink may be aligned on theelectrodes RME by receiving a dielectrophoretic force by the generatedelectric field. The electrodes RME1 and RME2 may be formed by aligning(or arranging) the light emitting elements ED and disconnecting portionsof the electrode lines. For example, signals for emitting light from thelight emitting elements ED may be applied to the electrodes RME1 andRME2.

The electrodes RME1 and RME2 disposed in each sub-pixel PXn may bedisposed on the first banks BNL1 spaced apart from each other. Therespective electrodes RME1 and RME2 may be disposed on sides of thefirst banks BNL1 in the first direction DR1 and disposed on the inclinedside surfaces of the first banks BNL1. In an embodiment, a width of eachof the electrodes RME1 and RME2 measured in the first direction DR1 maybe smaller than a width of each of the first banks BNL1 measured in thefirst direction DR1. Each of the electrodes RME1 and RME2 may cover atleast one side surface of the first bank BNL1 to reflect the lightemitted from the light emitting elements ED.

For example, a distance between the electrodes RME1 and RME2 spacedapart from each other in the first direction DR1 may be smaller than adistance between the first banks BNL1. At least partial areas of therespective electrodes RME1 and RME2 may be disposed (e.g., directlydisposed) on the third interlayer insulating layer IL3, such that therespective electrodes RME1 and RME2 may be disposed on the same plane.

The electrodes RME1 and RME2 may be connected (e.g., electricallyconnected) to the light emitting elements ED. For example, theelectrodes RME1 and RME2 may be connected to the second conductivelayer, such that the signals for emitting light from the light emittingelements ED may be applied to the electrodes RME1 and RME2. The firstelectrode RME1 may be connected (e.g., electrically connected) to thesecond conductive layer through a first contact hole CT1, and the secondelectrode RME2 may be connected (e.g., electrically connected) to thesecond conductive layer through a second contact hole CT2. For example,the first electrode RME1 may be in contact with the first conductivepattern layer CDP through the first contact hole CT1 formed in an areaoverlapping the second bank BNL2. The second electrode RME2 may be incontact with the second voltage line VL2 through the second contact holeCT2 formed in an area overlapping the second bank BNL2. The firstelectrode RME1 may be connected (e.g., electrically connected) to thefirst transistor T1 through the first conductive pattern layer CDP toreceive the first source voltage applied thereto, and the secondelectrode RME2 may receive the second source voltage applied theretothrough the second voltage line VL2. The first source voltage and thesecond source voltage may be transferred to the light emitting elementsED through the first electrode RME1 and the second electrode RME2,respectively. Since the first electrodes RME1 are separated for eachsub-pixel PXn, the light emitting elements ED of different sub-pixelsPXn may emit light individually.

It is illustrated in the drawing that the first contact hole CT1 and thesecond contact hole CT2 are formed at positions overlapping the secondbank BNL2, but embodiments are not limited thereto, positions of thefirst contact hole CT1 and the second hole CT2 may be variouslymodified. For example, the first contact hole CT1 and the second contacthole CT2 may be positioned in the light emitting area EMA surrounded bythe second bank BNL2, and in some embodiments, a larger number ofcontact holes may be formed.

Each of the electrodes RME1 and RME2 may include a conductive materialhaving high reflectivity. For example, each of the electrodes RME1 andRME2 may include a metal such as silver (Ag), copper (Cu), or aluminum(Al), or include an alloy including aluminum (Al), nickel (Ni),lanthanum (La), or the like, as the material having the highreflectivity Each of the electrodes RME1 and RME2 may reflect the lightemitted from the light emitting elements ED and transmitting toward theside surfaces of the first bank BNL1 in an upward direction (e.g., thirddirection DR3) of each sub-pixel PXn.

However, embodiments are not limited thereto, and each of the electrodesRME1 and RME2 may further include a transparent conductive material. Forexample, each of the electrodes RME1 and RME2 may include a materialsuch as ITO, IZO, or ITZO. In some embodiments, each of the electrodesRME may have a structure in which one or more layers made of atransparent conductive material and one or more layers made of a metalhaving high reflectivity are stacked or may be formed as a single layerincluding the transparent conductive material and the metal having thehigh reflectivity. For example, each of the electrodes RME1 and RME2 mayhave a stacked structure such as ITO/Ag/ITO, ITO/Ag/IZO, orITO/Ag/ITZO/IZO.

The electrodes RME1 and RME2 may be connected (e.g., electricallyconnected) to the light emitting elements ED, and may receive a certainvoltage applied thereto so that the light emitting elements ED emit thelight. For example, the electrodes RME1 and RME2 may be connected (e.g.,electrically connected) to the light emitting elements ED throughcontact electrodes CNE1 and CNE2 to be described below, and electricalsignals applied to the electrodes RME1 and RME2 may be transferred tothe light emitting elements ED through the contact electrodes CNE1 andCNE2.

A first insulating layer PAS1 may be disposed on the electrodes RME1 andRME2 and the first banks BNL1. The first insulating layer PAS1 may coverthe first banks BNL1, the first electrode RME1, and the second electrodeRME2, but may expose portions of upper surfaces of the first electrodeRME1 and the second electrode RME2. For example, the first insulatinglayer PAS1 may be substantially entirely disposed on the thirdinterlayer insulating layer IL3, but may include openings partiallyexposing the first electrode RME1 and the second electrode RME2.

In an embodiment, the first insulating layer PAS1 may have a step sothat a portion of an upper surface thereof may be recessed between thefirst electrode RME1 and the second electrode RME2 The first insulatinglayer PAS1 may cover the first electrode RME1 and the second electrodeRME2, and accordingly, may be stepped between the first electrode RME1and the second electrode RME2. However, embodiments are not limitedthereto. The first insulating layer PAS1 may insulate the firstelectrode RME1 and the second electrode RME2 from each other, and mayprotect the first electrode RME1 and the second electrode RME2. Forexample, the first insulating layer PAS1 may prevent the light emittingelement ED disposed on the first insulating layer PAS1 from being indirect contact with and being damaged by other members.

The second bank BNL2 may be disposed on the first insulating layer PAS1.The second bank BNL2 may be disposed in a lattice-shaped pattern overthe entirety of the first display substrate 100 by including portionsextending in the first direction DR1 and the second direction DR2 inplan view. The second bank BNL2 may be disposed across a boundary areabetween the respective sub-pixels PXn to divide neighboring sub-pixelsPXn. For example, the second bank BNL2 may surround the light emittingarea EMA and the sub-area CBA disposed in each sub-pixel PXn to dividethe light emitting area EMA and the sub-area CBA A portion disposedbetween the light emitting areas EMA in a portion of the second bankBNL2 extending in the second direction DR2 may have a greater width thana portion disposed between the sub-areas CBA. Accordingly, a distancebetween the sub-areas CBA may be smaller than a distance between thelight emitting areas EMA.

The second bank BNL2 may have a greater height than the first bank BNL1.The second bank BNL2 may prevent inks from overflowing into adjacentsub-pixels PXn in an inkjet printing process of the processes ofmanufacturing the display device 10 to separate inks in which differentlight emitting elements ED are dispersed for each of differentsub-pixels PXn from each other so that these inks may not be mixed witheach other. For example, the second bank BNL2 may prevent materials ofthe color control members TPL, WCL1, and WCL2 from overflowing intoother sub-pixels PXn A first bank BNL1 may be disposed across thesub-pixels PXn neighboring to each other in the first direction DR1, andaccordingly, a portion of the second bank BNL2 extending in the seconddirection DR2 may be disposed on the first bank BNL1 The second bankBNL2 may include polyimide (PI) like the first bank BNL1, butembodiments are not limited thereto.

The light emitting elements ED may be disposed on the first insulatinglayer PAS1. The light emitting elements ED may be spaced apart from eachother along the second direction DR2 in which the respective electrodesRME1 and RME2 extend, and may be aligned to be substantially parallel toeach other. The light emitting elements ED may have a shape extending ina direction, and a direction in which the respective electrodes RME1 andRME2 extend and a direction in which the light emitting elements EDextend may be substantially perpendicular to each other. However,embodiments are not limited thereto, and the light emitting elements EDmay also be oblique to the direction in which the respective electrodesRME1 and RME2 extend.

The light emitting element ED may include semiconductor layers dopedwith different conductivity types. The light emitting element ED mayinclude semiconductor layers, and may be oriented (or arranged) so thatend portion thereof faces a specific direction according to a directionof an electric field generated on the electrodes RME1 and RME2 Forexample, the light emitting element ED may include a light emittinglayer 36 (see FIG. 6 ) to emit light of a specific wavelength band. Thelight emitting element ED may emit light of different wavelength bandsaccording to a material of the light emitting layer 36. However, sincethe display device 10 includes the color control members TPL, WCL1, andWCL2 and the color filter layer CFL, even though the light emittingelements ED disposed in each sub-pixel PXn emit light of the same color,the display device 10 may display a different color for each sub-pixelPXn.

In an embodiment, the display device 10 may include light emittingelements ED emitting light of a first color, but light of differentcolors may be displayed in light transmitting areas TA1, TA2, and TA3corresponding to the respective sub-pixels PXn. For example, each offirst light emitting elements ED1 disposed in the first sub-pixel PX1,second light emitting elements ED2 disposed in the second sub-pixel PX2,and third light emitting elements ED3 disposed in the third sub-pixelPX3 may emit the light of the first color, but light passing through thecolor control members TPL, WCL1, and WCL2 in the first sub-pixel PX1,the second sub-pixel PX2, and the third sub-pixel PX3 may be emitted asthe light of the first color, light of a second color, and light of athird color, respectively.

The light emitting elements ED may be disposed on the respectiveelectrodes RME1 and RME2 between the first banks BNL1. For example, thelight emitting elements ED may be disposed so that end portions thereofmay be put on the first electrode RME1 and the other end portionsthereof may be put on the second electrode RME2. An extension length ofthe light emitting elements ED may be greater than the distance betweenthe first electrode RME1 and the second electrode RME2, and end portions(e.g., opposite end portions) of the light emitting elements ED may bedisposed on the first electrode RME1 and the second electrode RME2,respectively.

The light emitting element ED may include layers disposed in a directionparallel to the upper surface of the first substrate SUB1. The lightemitting element ED of the display device 10 may be disposed so that adirection in which the light emitting element ED extends is parallel tothe first substrate SUB1, and the semiconductor layers included in thelight emitting element ED may be sequentially disposed along thedirection parallel to the upper surface of the first substrate SUB1.However, embodiments are not limited thereto. In some cases, in casethat the light emitting element ED has another structure, the layers mayalso be disposed in a direction perpendicular to the first substrateSUB1.

End portions (e.g., opposite end portions) of the light emittingelements ED may be in contact with the contact electrodes CNE1 and CNE2,respectively. An insulating film 38 (see FIG. 6 ) may not be formed onend surfaces of the light emitting element ED in a direction in whichthe light emitting element ED extends and some of the semiconductorlayers are exposed. Thus, the exposed semiconductor layers may be incontact with the contact electrodes CNE1 and CNE2, respectively.However, embodiments are not limited thereto. In some cases, at leastpartial areas of the insulating film 38 of the light emitting element EDmay be removed and the insulating film 38 may be removed, such that sidesurfaces of end portions (e.g., opposite end portions) of thesemiconductor layers may be partially exposed. The exposed side surfacesof the semiconductor layers may also be in contact with (e.g., in directcontact with) the contact electrodes CNE1 and CNE2.

A second insulating layer PAS2 may be partially disposed on the lightemitting elements ED. As an example, the second insulating layer PAS2may partially surround outer surfaces of the light emitting elements ED,and may be disposed so as not to cover end portions and the other endportions of the light emitting elements ED. Contact electrodes CNE1 andCNE2 to be described below may be in contact with end portions (e.g.,opposite end portions) of the light emitting elements ED that are notcovered by the second insulating layer PAS2, respectively. Portions ofthe second insulating layer PAS2 disposed on the light emitting elementsED may extend in the second direction DR2 on the first insulating layerPAS1 in plan view to form a linear pattern or an island-shaped patternwithin each sub-pixel PXn. The second insulating layer PAS2 may fix thelight emitting elements ED in the processes of manufacturing the displaydevice 10, and may protect the light emitting elements ED.

Contact electrodes CNE1 and CNE2 and a third insulating layer PAS3 maybe disposed on the second insulating layer PAS2.

The contact electrodes CNE1 and CNE2 may have a shape extending in adirection. The contact electrodes CNE1 and CNE2 may include a firstcontact electrode CNE1 and a second contact electrode CNE2. The firstcontact electrode CNE1 may be disposed on the first electrode RME1, thesecond contact electrode CNE2 may be disposed on the second electrodeRME2, and each of the first contact electrode CNE1 and the secondcontact electrode CNE2 may have a shape extending in the seconddirection DR2. The first contact electrode CNE1 and the second contactelectrode CNE2 may be spaced apart from and face each other in the firstdirection DR1, and may form a linear pattern in the light emitting areaEMA of each sub-pixel PXn.

In some embodiments, widths of the first contact electrode CNE1 and thesecond contact electrode CNE2 measured in a direction may be smallerthan widths of the first electrode RME1 and the second electrode RME2measured in the direction, respectively. The first contact electrodeCNE1 and the second contact electrode CNE2 may cover portions of theupper surfaces of the first electrode RME1 and the second electrode RME2with being in contact with end portions and the other end portions ofthe light emitting elements ED, respectively.

The contact electrodes CNE1 and CNE2 may be in contact with the lightemitting elements ED and the electrodes RME1 and RME2, respectively. Thelight emitting elements ED may have semiconductor layers exposed on endsurfaces (e.g., opposite end surfaces) thereof in the direction in whichthey extend, and the first contact electrode CNE1 and the second contactelectrode CNE2 may be in contact with the light emitting elements ED onthe end surfaces on which the semiconductor layers are exposed. Endportions of the light emitting elements ED may be connected (e.g.,electrically connected) to the first electrode RME1 through the firstcontact electrode CNE1, and the other end portions of the light emittingelements ED may be connected (e.g., electrically connected) to thesecond electrode RME2 through the second contact electrode CNE2.

It is illustrated in the drawing that a first contact electrode CNE1 anda second contact electrode CNE2 are disposed in a sub-pixel PXn, butembodiments are not limited thereto. The numbers of first contactelectrode CNE1 and second contact electrode CNE2 may change according tothe numbers of first electrodes RME1 and second electrodes RME2 disposedin each sub-pixel PXn.

The third insulating layer PAS3 may be disposed on the first contactelectrode CNE1. The third insulating layer PAS3 may electricallyinsulate the first contact electrode CNE1 and the second contactelectrode CNE2 from each other. The third insulating layer PAS3 maycover the first contact electrode CNE1, but may not be disposed on theother end portions of the light emitting elements ED so that the lightemitting elements ED may be in contact with the second contact electrodeCNE2. The third insulating layer PAS3 may be in contact with the firstcontact electrode CNE1 and the second insulating layer PAS2 on an uppersurface of the second insulating layer PAS2. A side surface of the thirdinsulating layer PAS3 in a direction in which the second electrode RME2is disposed may be aligned with a side surface of the second insulatinglayer PAS2 For example, the third insulating layer PAS3 may be disposedon the non-light emitting area, for example, on the first insulatinglayer PAS1 disposed on the third interlayer insulating layer IL3.However, embodiments are not limited thereto.

The second contact electrode CNE2 may be disposed on the secondelectrode RME2, the second insulating layer PAS2, and the thirdinsulating layer PAS3. The second contact electrode CNE2 may be incontact with the other end portions of the light emitting elements EDand an exposed upper surface of the second electrode RME2. The other endportions of the light emitting elements ED may be connected (e.g.,electrically connected) to the second electrode RME2 through the secondcontact electrode CNE2.

The second contact electrode CNE2 may be in contact with the secondinsulating layer PAS2, the third insulating layer PAS3, the secondelectrode RME2, and the light emitting elements ED. The first contactelectrode CNE1 and the second contact electrode CNE2 may not be incontact with each other by the second insulating layer PAS2 and thethird insulating layer PAS3. However, embodiments are not limitedthereto, and in some cases, the third insulating layer PAS3 may beomitted.

The contact electrodes CNE1 and CNE2 may include a conductive material.For example, the contact electrodes CNE1 and CNE2 may include ITO, IZO,ITZO, aluminum (Al), or the like. As an example, the contact electrodesCNE1 and CNE2 may include a transparent conductive material, and thelight emitted from the light emitting elements ED may be transmittedthrough the contact electrodes CNE1 and CNE2 and may transmit toward theelectrodes RME1 and RME2. However, embodiments are not limited thereto.

For example, an insulating layer may be additionally formed to cover thecontact electrodes CNE1 and CNE2, the third insulating layer PAS3, andthe second bank BNL2. Such an insulating layer may be disposed (e.g.,entirely disposed) on the first substrate SUB1 and may function toprotect members disposed on the first substrate SUB1 from an externalenvironment.

Each of the first insulating layer PAS1, the second insulating layerPAS2, and the third insulating layer PAS3 described above may include aninorganic insulating material or an organic insulating material. In anembodiment, the first insulating layer PAS1, the second insulating layerPAS2, and the third insulating layer PAS3 may include an inorganicinsulating material such as silicon oxide (SiO_(x)), silicon nitride(SiN_(x)), silicon oxynitride (SiO_(x)N_(y)), aluminum oxide(Al_(x)O_(y)), or aluminum nitride (Al_(x)N_(y)). In another example,the first insulating layer PAS1, the second insulating layer PAS2, andthe third insulating layer PAS3 may include an organic insulatingmaterial such as an acrylic resin, an epoxy resin, a phenolic resin, apolyamide resin, a polyimide resin, an unsaturated polyester resin, apolyphenylene resin, a polyphenylene sulfide resin, benzocyclobutene, acardo resin, a siloxane resin, a silsesquioxane resin, polymethylmethacrylate, polycarbonate, or a polymethyl methacrylate-polycarbonatesynthetic resin. However, embodiments are not limited thereto.

The color control members TPL, WCL1, and WCL2 may be disposed on thelight emitting elements ED. According to an embodiment, the colorcontrol members TPL, WCL1, and WCL2 may be disposed in areas surroundedby the second bank BNL2. The color control members TPL, WCL1, and WCL2may be disposed in each sub-pixel PXn, and may be disposed in the lightemitting areas EMA among the areas surrounded by the second bank BNL2but may not be disposed in the sub-areas CBA The sub-areas CBA may beareas in which the light emitting elements ED are not disposed, andlight may not be substantially emitted in the sub-areas CBA. The colorcontrol members TPL, WCL1, and WCL2 may be disposed in the areassurrounded by the second bank BNL2 in areas in which the light emittingelements ED are disposed.

In some embodiments, a height of the color control members TPL, WCL1,and WCL2 may be greater than a height of the second bank BNL2 The colorcontrol members TPL, WCL1, and WCL2 may be formed by an inkjet printingprocess or a photoresist process among the processes of manufacturingthe display device 10. The color control members TPL, WCL1, and WCL2 maybe formed by jetting or applying materials of the color control membersTPL, WCL1, and WCL2 into the areas surrounded by the second bank BNL2and performing drying or exposing and developing processes. As anexample, the materials of the color control members TPL, WCL1, and WCL2may include an organic material to have viscosity, and even though theorganic material is jetted or applied up to a position higher than thesecond bank BNL2, the organic material may not overflow into othersub-pixels PXn beyond the second bank BNL2. Accordingly, the height ofthe color control members TPL, WCL1, and WCL2 may be greater than thatof the second bank BNL2. However, embodiments are not limited thereto.

In an embodiment in which the light emitting elements of each sub-pixelPXn emit the light of the first color, the color control members TPL,WCL1, and WCL2 may include a light transmitting layer TPL disposed inthe first sub-pixel PX1, a first wavelength conversion layer WCL1disposed in the second sub-pixel PX2, and a second wavelength conversionlayer WCL2 disposed in the third sub-pixel PX3.

The light transmitting layer TPL may include a first base resin BRS1 andscatterers SCP disposed in the first base resin BRS1. The lighttransmitting layer TPL may transmit the light of the first colorincident from the light emitting elements ED therethrough withmaintaining a wavelength of the light of the first color. The scatterersSCP of the light transmitting layer TPL may function to adjust anemission path of the light emitted through the light transmitting layerTPL. The light transmitting layer TPL may not include wavelengthconversion materials.

The first wavelength conversion layer WCL1 may include a second baseresin BRS2 and first wavelength conversion materials WCP1 disposed inthe second base resin BRS2. The second wavelength conversion layer WCL2may include a third base resin BRS3 and second wavelength conversionmaterials WCP2 disposed in the third base resin BRS3. The firstwavelength conversion layer WCL1 and the second wavelength conversionlayer WCL2 may convert a wavelength of the light of the first colorincident from the light emitting elements ED and may transmit the lighthaving the converted wavelength therethrough. Scatterers SCP of thefirst wavelength conversion layer WCL1 and the second wavelengthconversion layer WCL2 may increase wavelength conversion efficiency.

The scatterers SCP may be metal oxide particles or organic particles.Examples of metal oxide of the metal oxide particles may includetitanium oxide (TiO₂), zirconium oxide (ZrO₂), aluminum oxide(Al_(x)O_(y)), indium oxide (In₂O₃), zinc oxide (ZnO), tin oxide (SnO₂),or the like, and examples of a material of the organic particles mayinclude an acrylic resin, a urethane resin, or the like.

The first, second, and third base resins BRS1, BRS2, and BRS3 mayinclude a light transmitting organic material. For example, the first,second, and third base resins BRS1, BRS2, and BRS3 may include anepoxy-based resin, an acrylic resin, a cardo-based resin, an imide-basedresin, or the like. All of the first, second, and third base resinsBRS1, BRS2, and BRS3 may be made of the same material, but embodimentsare not limited thereto.

The first wavelength conversion material WCP1 may be a material thatconverts the light of the first color into light of a second color, andthe second wavelength conversion material WCP2 may be a material thatconverts the light of the first color into light of a third color. Thefirst wavelength conversion material WCP1 and the second wavelengthconversion material WCP2 may be quantum dots, quantum rods, phosphors,or the like. The quantum dot may include group IV nanocrystals, groupII-VI compound nanocrystals, group III-V compound nanocrystals, groupIV-VI nanocrystals, or combinations thereof.

The color control members TPL, WCL1, and WCL2 may be disposed in theareas in which the light emitting elements ED are disposed, and may besurrounded by the second bank BNL2. In the display device 10, the secondbank BNL2 may have a certain height and may surround the sub-pixels PXn.Thus, the base resins BRS1, BRS2, and BRS3 of the color control membersTPL, WCL1, and WCL2 may be disposed (e.g., directly disposed) on thelight emitting elements ED and the contact electrodes CNE1 and CNE2connected to the light emitting elements ED.

According to an embodiment, the light transmitting layer TPL, the firstwavelength conversion layer WCL1, and the second wavelength conversionlayer WCL2 of the color control members TPL, WCL1, and WCL2 maycorrespond to the light emitting areas EMA surrounded by the second bankBNL2. Widths of the light transmitting layer TPL, the first wavelengthconversion layer WCL1, and the second wavelength conversion layer WCL2measured in the first direction DR1 may be smaller than a width of eachcolor filter layer CFL measured in the first direction DR1. The colorfilter layers CFL may be disposed in areas surrounded by the secondlight blocking member BM2, and the second light blocking member BM2 mayhave a smaller width than the second bank BNL2, such that the colorfilter layers CFL may partially overlap the second bank BNL2 in thethird direction DR3 (e.g., the thickness direction). For example, thecolor control members TPL, WCL1, and WCL2 may have substantially thesame width as the light emitting areas EMA surrounded by the second bankBNL2, and may thus have a smaller width than the color filter layersCFL.

For example, the base resins BRS1, BRS2, and BRS3 may surround the lightemitting elements ED, the first banks BNL1, the electrodes RME1 andRME2, the contact electrodes CNE1 and CNE2, and the like, disposed onthe third interlayer insulating layer IL3 within the areas surrounded bythe second bank BNL2. For example, the scatterers SCP and the wavelengthconversion materials WCP1 and WCP2 of the color control members TPL,WCL1, and WCL2 may be disposed in the respective base resins BRS1. BRS2,and BRS3, and may be positioned in the vicinity of the light emittingelements ED.

Light emitted from the respective light emitting elements ED may be thelight of the same first color. Light emitted from end portions (e.g.,opposite end portions) of the light emitting elements ED may bereflected from the electrodes RME1 and RME2 disposed on the first banksBNL1 and may transmit toward the color control members TPL, WCL1, andWCL2 disposed on the light emitting elements ED. Light emitted from thefirst light emitting elements ED1 disposed in the first sub-pixel PX1may be incident on the light transmitting layer TPL. Light emitted fromthe second light emitting elements ED2 disposed in the second sub-pixelPX2 may be incident on the first wavelength conversion layer WCL1. Lightemitted from the third light emitting elements ED3 disposed in the thirdsub-pixel PX3 may be incident on the second wavelength conversion layerWCL2. The light incident on the light transmitting layer TPL may betransmitted as the light of the same first color without wavelengthconversion, the light of the first color incident on the firstwavelength conversion layer WCL1 may be converted into the light of thesecond color, and the light of the first color incident on the secondwavelength conversion layer WCL2 may be converted into the light of thethird color Even though the respective sub-pixels PXn include the lightemitting elements ED emitting the light of the same color, therespective sub-pixels PXn may display light of different colorsaccording to an arrangement of the color control members TPL, WCL1, andWCL2 disposed on the light emitting elements ED.

Even though the display device 10 according to an embodiment includesonly the light emitting elements ED emitting the light of the firstcolor, the display device 10 may convert the light of the first colorinto light of other colors through the color control members TPL, WCL1,and WCL2 and emit the light of other colors. The color control membersTPL, WCL1, and WCL2 may be disposed (e.g., directly disposed) on thelight emitting elements ED in the first display substrate 100 of thedisplay device 10, and most of the light emitted from the light emittingelements ED may be incident (e.g., directly incident) on the colorcontrol members TPL, WCL1, and WCL2 without being reflected or absorbedby other members. For example, the first wavelength conversion layerWCL1 and the second wavelength conversion layer WCL2, which convert thelight emitted from the light emitting elements ED into the light ofother colors, may be disposed (e.g., directly disposed) at least on thelight emitting elements ED. Thus, light conversion efficiency and acolor matching rate may be improved.

It is illustrated in the drawing that all of the color control membersTPL, WCL1, and WCL2 are disposed on the first display substrate 100, butembodiments are not limited thereto. In some embodiments, some of thecolor control members TPL, WCL1, and WCL2 may also be disposed on thesecond display substrate 300. This will be described with reference toother embodiments.

A first capping layer CPL1 may be disposed on the color control membersTPL, WCL1, and WCL2. The first capping layer CPL1 may cover the colorcontrol members TPL, WCL1, and WCL2 and the second bank BNL2. The firstcapping layer CPL1 may prevent a phenomenon in which impurities such asmoisture or air permeate from the outside to damage or contaminate thecolor control members TPL, WCL1, and WCL2. For example, the firstcapping layer CPL1 may prevent the materials of the color controlmembers TPL, WCL1, and WCL2 from being diffused (or permeated) intoother components. The first capping layer CPL1 may be made of aninorganic material. For example, the first capping layer CPL1 mayinclude silicon nitride, aluminum nitride, zirconium nitride, titaniumnitride, hafnium nitride, tantalum nitride, silicon oxide, aluminumoxide, titanium oxide, tin oxide, silicon oxynitride, and the like. Inanother example, the first capping layer CPL1 may be omitted.

A first light blocking member BM1 may be disposed on the first cappinglayer CPL1. The first light blocking member BM1 may be made of amaterial capable of blocking light transmission to prevent theoccurrence of color mixing due to permeation of the light emitted fromthe color control members TPL, WCL1, and WCL2 into adjacent sub-pixelsPXn. The first light blocking member BM1 may be disposed along theboundary area between the sub-pixels PXn. For example, the first lightblocking member BM1 may be disposed along spaces between the colorcontrol members TPL, WCL1, and WCL2 spaced apart from each other, andmay overlap the non-light emitting areas NEA or the second bank BNL2 inthe thickness direction. The first light blocking member BM1 may fillvalley portions disposed in the spaces between the color control membersTPL, WCL1, and WCL2 spaced apart from each other. An upper surface ofthe first light blocking member BM1 may be recessed as compared withupper surfaces of the color control members TPL, WCL1, and WCL2 in thethickness direction, but embodiments are not limited thereto. In anotherexample, an upper surface of the first light blocking member BM1 mayalso be higher than upper surfaces of the color control members TPL,WCL1, and WCL2, or may also be flat or protrude upward.

The first light blocking member BM1 may include an organic material. Thefirst light blocking member BM1 may include a light absorbing materialabsorbing light of a visible light wavelength band. In an embodiment,the first light blocking member BM1 may include an organic lightblocking material.

The second light blocking member BM2 and the color filter layers CFL1,CFL2 and CFL3 of the second display substrate 300 may be disposed on thecolor control members TPL, WCL1, and WCL2 and the first light blockingmember BM1. A base layer SML may be disposed on the color controlmembers TPL, WCL1, and WCL2 and the first light blocking member BM1, andthe first display substrate 100 may be bonded to the second displaysubstrate 300 through the base layer SML.

The base layer SML may function to couple the first display substrate100 and the second display substrate 300 to each other, and may fill aspace between the first display substrate 100 and the second displaysubstrate 300. The base layer SML may be disposed on the first cappinglayer CPL1 and the first light blocking member BM1 of the first displaysubstrate 100, and may planarize a step formed by the first cappinglayer CPL1 and the first light blocking member BM1. For example, thebase layer SML may be made of a material capable of transmitting light,and accordingly, the light emitted from the first display substrate 100may be emitted through the second display substrate 300. As an example,the base layer SML may be made of a Si-based organic material, anepoxy-based organic material, or the like, but embodiments are notlimited thereto. In some embodiments, the base layer SML may include alow refractive material and fill the space between the first displaysubstrate 100 and the second display substrate 300.

The second display substrate 300 may include the second substrate SUB2and the second light blocking member BM2 and the color filter layer CFLdisposed on a surface of the second substrate SUB2 facing the firstsubstrate SUB1 The second substrate SUB2 may be made of a transparentinsulating material such as glass, quartz, or a polymer resin, similarto the first substrate SUB1. For example, the first substrate SUB1 maybe a rigid substrate, but may also be a flexible substrate that isbendable, foldable, or rollable. The second substrate SUB2 may includelight transmitting areas TA1, TA2 and TA3 and light blocking areas BA.The light transmitting areas TA1, TA2, and TA3 may correspond to thelight emitting areas EMA of the first display substrate 100, and thelight blocking areas BA may correspond to the non-light emitting areasNEA. The light transmitting areas TA1, TA2, and TA3 may correspond tothe respective sub-pixels PXn and include a first light transmittingarea TA1, a second light transmitting area TA2, and a third lighttransmitting area TA3. The light transmitting areas TA1, TA2, and TA3may be areas in which the color filter layer CFL is disposed and thelight emitted from the light emitting elements ED is transmitted, andthe light blocking areas BA may be areas in which the second lightblocking member BM2 is disposed, and accordingly, the light is notemitted.

The second light blocking member BM2 may be disposed on a surface of thesecond substrate SUB2, e.g., a surface of the second substrate SUB2facing the first substrate SUB1. The second light blocking member BM2may overlap the second bank BNL2 of the first display substrate 100 inthe thickness direction (e.g., the third direction DR3), and may bedisposed in the light blocking areas BA. The second light blockingmember BM2 may be formed in a lattice shape in a plan view includingopenings exposing a surface of the second substrate SUB2. The secondlight blocking member BM2 may overlap portions of the second bank BNL2in the boundary areas between the sub-pixels PXn. For example, thesecond light blocking member BM2 may not surround only areascorresponding to the light emitting areas EMA, and may be disposed atboundary areas between the sub-pixels PXn in which the color filterlayers CFL1, CFL2, and CFL3 are disposed as well as in portions of thenon-light emitting areas NEA.

The second light blocking member BM2 may include an organic material.The second light blocking member BM2 may reduce distortion of colors dueto external light reflection by absorbing external light. In anembodiment, the second light blocking member BM2 may absorb all ofvisible light wavelengths. The second light blocking member BM2 mayinclude a light absorbing material. For example, the first lightblocking member BM1 and the second light blocking member BM2 may be madeof substantially the same material.

In another example, the second light blocking member BM2 may absorblight of a specific wavelength of visible light wavelengths and transmitlight of another specific wavelength therethrough. For example, thesecond light blocking member BM2 and a first color filter layer CFL1 maybe made of the same material. In some embodiments, the second lightblocking member BM2 may be integral with the first color filter layer.

The color filter layers CFL1, CFL2, and CFL3 may be disposed on thesecond substrate SUB2 exposed through the openings of the second lightblocking member BM2. The color filter layers CFL1, CFL2, and CFL3 mayinclude the first color filter layer CFL1 disposed in the first lighttransmitting area TA1 corresponding to the first sub-pixel PX1, a secondcolor filter layer CFL2 disposed in the second light transmitting areaTA2 corresponding to the second sub-pixel PX2, and a third color filterlayer CFL3 disposed in the third light transmitting area TA3corresponding to the third sub-pixel PX3. Each of the color filterlayers CFL1, CFL2, and CFL3 may include a colorant such as a dye or apigment absorbing light of a wavelength other than a color wavelengthdisplayed by each sub-pixel PXn. The first color filter layer CFL1 maybe a blue color filter layer, the second color filter layer CFL2 may bea green color filter, and the third color filter layer CFL3 may be a redcolor filter layer. The light emitted from the light emitting elementsED may pass through the color control members TPL, WCL1, and WCL2 and beemitted through the color filter layers CFL1, CFL2, and CFL3.

For example, the light of the first color emitted from the first lightemitting elements ED1 of the first sub-pixel PX1 may pass through thelight transmitting layer TPL and may be incident on the first colorfilter layer CFL1 in a state in which a color of the light is notchanged. The first base resin BRS1 of the light transmitting layer TPLmay be made of a transparent material, and some of the light may betransmitted through the first base resin BRS1 and may be incident on thefirst capping layer CPL1 and the first color filter layer CFL1 disposedon the first base resin BRS1. For example, at least some of the lightmay be incident on the scatterers SCP disposed in the first base resinBRS1 to be scattered, and may be incident on the first capping layerCPL1 and the first color filter layer CFL1. The first color filter layerCFL1 may block transmission of light of colors other than the light ofthe first color, and the light of the first color may be displayed inthe first light transmitting area TAL.

The light of the first color emitted from the second light emittingelements ED2 of the second sub-pixel PX2 may pass through the firstwavelength conversion layer WCL1, such that some of the light of thefirst color may be converted into the light of the second color and maybe incident on the second color filter layer CFL2. The second base resinBRS2 of the first wavelength conversion layer WCL1 may be made of atransparent material, and some of the light may be transmitted throughthe second base resin BRS2. However, at least some of the light may beincident on the scatterers SCP and the first wavelength conversionmaterials WCP1 disposed in the second base resin BRS2, may be scatteredand wavelength-converted, and may be incident on the first capping layerCPL1 and the second color filter layer CFL2 as the light of the secondcolor The second color filter layer CFL2 may block transmission of lightof colors other than the light of the second color, and the light of thesecond color may be displayed in the second light transmitting area TA2.In the third light transmitting area TA3, the light of the first coloremitted from the third light emitting elements ED3 may pass through thesecond wavelength conversion layer WCL2 and the third color filter layerCFL3 to be displayed as the light of the third color. The display device10 may display light of a different color for each sub-pixel PXn eventhough the respective light emitting elements ED include the lightemitting elements ED emitting the light of the same color.

It is illustrated in the drawing that neighboring color filter layersCFL1, CFL2, and CFL3 are disposed to be spaced apart from each otherbased on the second light blocking member BM2, but the neighboring colorfilter layers CFL1, CFL2, and CFL3 may also at least partially overlapeach other on the second light blocking member BM2.

The color filter layers CFL1, CFL2, and CFL3 may cover the lightemitting areas EMA in the respective sub-pixels PXn. It is illustratedin the drawing that the color filter layers CFL1, CFL2, and CFL3 aredisposed in each sub-pixel PXn to form an island-shaped pattern, butembodiments are not limited thereto. The color filter layers CFL1, CFL2,and CFL3 may also form a linear pattern over the entirety of the displayarea DPA. For example, the second light blocking member BM2 may have asmaller width than the second bank BNL2, and the color filter layersCFL1, CFL2, and CFL3 may partially overlap the second bank BNL2 in thethickness direction.

A second capping layer CPL2 may be disposed on the color filter layersCFL1, CFL2, and CFL3 and the second light blocking member BM2 The secondcapping layer CPL2 may prevent impurities such as moisture or air frompermeating from the outside to damage or contaminate the color filterlayers CFL1, CFL2, and CFL3 The second capping layer CPL2 and the firstcapping layer CPL1 may include the same material, but embodiments arenot limited thereto.

In the display device 10 according to an embodiment, by disposing thecolor control members TPL, WCL1, and WCL2 in the first display substrate100 together with the light emitting elements ED, the light conversionefficiency using the light emitted from the light emitting elements EDmay be improved, and the color matching rate may be improved. Further,by disposing the color filter layer CFL in the second display substrate300, which is separated from the first display substrate 100, the colorcontrol members TPL, WCL1, and WCL2 may be protected from being damagedin a thermal process required in case that the color filter layer CFL isformed. The display device 10 may include the color control members TPL,WCL1, and WCL2 and the color filter layer CFL with using the lightemitting elements ED including the semiconductor layers. Thus, a displaydevice may be implemented to have improved light efficiency and colormatching rate.

FIG. 6 is a schematic view of a light emitting element according to anembodiment.

The light emitting element ED may be a light emitting diode. Forexample, the light emitting element ED may be an inorganic lightemitting diode having a size of a micrometer or nanometer unit and madeof an inorganic material or an inorganic semiconductor The inorganiclight emitting diodes may be aligned between two electrodes in whichpolarities are formed in case that an electric field is formed in aspecific direction between the two electrodes facing each other. Thelight emitting elements ED may be aligned between the two electrodes bythe electric field formed on the two electrodes.

The light emitting element ED according to an embodiment may have ashape extending in a direction. The light emitting element ED may have ashape such as a rod shape, a wire shape, or a tube shape. In anembodiment, the light emitting element ED may have a cylindrical shapeor a rod shape. However, the light emitting element ED is not limited tothe shape described above, and may have various shapes. For example, thelight emitting element ED may have a polygonal prismatic shape such as acubic shape, a rectangular parallelepiped shape, or a hexagonalprismatic shape or may have a shape extending in a direction andincluding partially inclined outer surfaces. Semiconductors included ina light emitting element ED to be described below may have a structurein which they are sequentially disposed or stacked along the direction.

The light emitting element ED may include a semiconductor layer dopedwith any conductivity-type (e.g., p-type or n-type) impurities. Thesemiconductor layer may receive an electrical signal applied from anexternal power source to emit light of a specific wavelength band.

Referring to FIG. 6 , the light emitting element ED may include a firstsemiconductor layer 31, a second semiconductor layer 32, a lightemitting layer 36, an electrode layer 37, and an insulating film 38.

The first semiconductor layer 31 may be an n-type semiconductor. In casethat the light emitting element ED emits light of a blue wavelengthband, the first semiconductor layer 31 may include a semiconductormaterial having a chemical formula: Al_(x)Ga_(y)In_(1-x-y)N (0≤x≤1,0≤y≤1, and 0≤x+y≤1). For example, the semiconductor material may be oneor more of AlGalnN, GaN, AlGaN, InGaN, AlN, and InN doped with an n-typedopant. The first semiconductor layer 31 may be doped with an n-typedopant, which may be Si, Ge, Sn, or the like. In an embodiment, thefirst semiconductor layer 31 may be made of n-GaN doped with n-type Si.A length of the first semiconductor layer 31 may be in the range ofabout 1.5 μm to about 5 μm, but embodiments are not limited thereto.

The second semiconductor layer 32 may be disposed on a light emittinglayer 36 to be described below. The second semiconductor layer 32 may bea p-type semiconductor, and as an example, in case that the lightemitting element ED emits light of a blue or green wavelength band, thesecond semiconductor layer 32 may include a semiconductor materialhaving a chemical formula: Al_(x)Ga_(y)In_(1-x-y)N (0≤x≤1, 0≤y≤1, and0≤x+y≤1). For example, the semiconductor material may be one or more ofAlGaInN, GaN, AlGaN, InGaN, AlN, and InN doped with a p-type dopant. Thesecond semiconductor layer 32 may be doped with a p-type dopant, whichmay be Mg, Zn, Ca, Ba, or the like. In an embodiment, the secondsemiconductor layer 32 may be made of p-GaN doped with p-type Mg. Alength of the second semiconductor layer 32 may be in the range of about0.05 μm to about 0.10 μm, but embodiments are not limited thereto.

It is illustrated in the drawing that each of the first semiconductorlayer 31 and the second semiconductor layer 32 is formed as a singlelayer, but embodiments are not limited thereto. According to someembodiments, each of the first semiconductor layer 31 and the secondsemiconductor layer 32 may further include a larger number of layers,for example, a clad layer or a tensile strain barrier reducing (TSBR)layer, according to a material of the light emitting layer 36.

The light emitting layer 36 may be disposed between the firstsemiconductor layer 31 and the second semiconductor layer 32. The lightemitting layer 36 may include a material having a single quantum wellstructure or a multiple quantum well structure. In case that the lightemitting layer 36 includes the material having the multiple quantum wellstructure, the light emitting layer 36 may have a structure in whichquantum layers and well layers are alternately stacked. As an example,in case that the light emitting layer 36 emits light of a bluewavelength band, the light emitting layer 36 may include a material suchas AlGaN or AlGaInN. For example, in case that the light emitting layer36 has the multiple quantum well structure, e.g., the structure in whichthe quantum layers and the well layers are alternately stacked, thequantum layers may include a material such as AlGaN or AlGaInN, and thewell layers may include a material such as GaN or AlInN. In anembodiment, the light emitting layer 36 may include AlGaInN as amaterial of the quantum layers and AlInN as a material of the welllayers to emit blue light having a central wavelength band in the rangeof about 450 nm to about 495 nm, as described above.

However, embodiments are not limited thereto, and the light emittinglayer 36 may have a structure in which semiconductor materials havinggreat band gap energy and semiconductor materials having small band gapenergy are alternately stacked, and may include other Group III to GroupV semiconductor materials according to a wavelength band of emittedlight. The light emitted by the light emitting layer 36 is not limitedto the light of the blue wavelength band, and in some cases, the lightemitting layer 36 may also emit light of red and green wavelength bands.A length of the light emitting layer 36 may be in the range of about0.05 μm to about 0.10 μm, but embodiments are not limited thereto.

For example, the light emitted from the light emitting layer 36 may beemitted not only to outer surfaces of the light emitting element ED in alength direction, but also to side surfaces (e.g., opposite sidesurfaces) of the light emitting element ED. A direction of the lightemitted from the light emitting layer 36 is not limited to a direction.

The electrode layer 37 may be an ohmic contact electrode. However,embodiments are not limited thereto, and the electrode layer 37 may alsobe a Schottky contact electrode. The light emitting element ED mayinclude at least one electrode layer 37. It is illustrated in FIG. 6that the light emitting element ED includes one electrode layer 37, butembodiments are not limited thereto. In some cases, the light emittingelement ED may include a larger number of electrode layers 37 or theelectrode layer 37 may be omitted. A description of a light emittingelement ED to be provided below is equally applied even though thenumber of electrode layers 37 is changed or the light emitting element30 further includes another structure.

The electrode layer 37 may decrease resistance between the lightemitting element E) and the electrodes or the contact electrodes in casethat the light emitting element ED is electrically connected to theelectrodes or the contact electrodes in the display device 10 accordingto an embodiment. The electrode layer 37 may include a metal havingconductivity. The electrode layer 37 may include at least one ofaluminum (Al), titanium (Ti), indium (In), gold (Au), silver (Ag),indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zincoxide (ITZO). The electrode layer 37 may include a semiconductormaterial doped with an n-type dopant or a p-type dopant. However,embodiments are not limited thereto.

The insulating film 38 may surround outer surfaces of the semiconductorlayers and the electrode layers described above. In an embodiment, theinsulating film 38 may surround at least an outer surface of the lightemitting layer 36, and may extend in a direction in which the lightemitting element ED extends. The insulating film 38 may function toprotect these members. As an example, the insulating film 38 maysurround side surface portions of these members, but may expose endportions (e.g., opposite end portions) of the light emitting element EDin the length direction.

It is illustrated in the drawing that the insulating film 38 is formedto extend in the length direction of the light emitting element ED tocover side surfaces of the first semiconductor layer 31 to the electrodelayer 37, but embodiments are not limited thereto. The insulating film38 may cover outer surfaces of the light emitting layer 36 and some ofthe semiconductor layers or cover a portion of a side surface of theelectrode layer 37, such that the side surface of each electrode layer37 may be partially exposed. For example, the insulating film 38 mayalso be formed so that an upper surface thereof may be rounded in crosssection in an area adjacent to at least one end portion of the lightemitting element ED A thickness of the insulating film 38 may be in therange of about 10 nm to about 1.0 μm, but embodiments are not limitedthereto. The thickness of the insulating film 38 may be about 40 nm.

The insulating film 38 may include materials having insulatingproperties, such as silicon oxide (SiO_(x)), silicon nitride (SiN_(x)),silicon oxynitride (SiO_(x)N_(y)), aluminum nitride (Al_(x)N_(y)), andaluminum oxide (AlO_(x)). Accordingly, an electrical short circuit thatoccurs in case that the light emitting layer 36 is in direct contactwith an electrode through which an electrical signal is transferred tothe light emitting element ED may be prevented. The insulating film 38may protect an outer surface of the light emitting element ED as well asthe light emitting layer 36, and may thus prevent (or minimize) adecrease in luminous efficiency.

In some embodiments, an outer surface of the insulating film 38 may besurface-treated. The light emitting elements ED may be jetted onto andbe aligned on electrodes in a state in which they are dispersed in ink.In order to maintain the light emitting elements ED in a state in whichthe light emitting elements ED are dispersed without being agglomeratedwith other adjacent light emitting elements ED in the ink, a hydrophobicor hydrophilic treatment may be performed on a surface of the insulatingfilm 38.

The light emitting element ED may have a length h in a range of about 1μm to about 10 μm, in a range of about 2 μm to about 6 μm, or in a rangeof about 3 μm to about 5 μm. For example, a diameter of the lightemitting element ED may be in the range of about 30 nm to about 700 nm,and an aspect ratio of the light emitting element ED may be about 1.2 toabout 100. However, embodiments are not limited thereto, and the lightemitting elements ED included in the display device 10 may also havedifferent diameters according to a difference in composition between thelight emitting layers 36. For example, the diameter of the lightemitting element ED may be about 500 nm.

Hereinafter, processes for manufacturing the display device 10 accordingto an embodiment will be described with further reference to otherdrawings.

FIGS. 7 to 17 are schematic cross-sectional views illustrating processesof manufacturing the display device according to an embodiment.

In processes of manufacturing the display device 10 to be described withreference to FIGS. 7 to 17 , the order and a method of formingrespective layers will be described in detail, and structures andarrangements of the respective layers are the same as those describedabove, and a detailed description thereof will thus be omitted fordescriptive convenience.

First, referring to FIG. 7 , the first substrate SUB1 on which thecircuit layer CCL is formed may be prepared, and the first bank BNL1,the electrodes RME1 and RME2, the first insulating layer PAS1 and thesecond bank BNl2 may be prepared. A description of arrangements andstructures of the respective members is the same as described above.However, the first insulating layer PAS1 may cover the entirety of theupper surfaces of the electrodes RME1 and RME2, and may be formed in astate in which openings in which the contact electrodes CNE1 and CNE2and the electrodes RME1 and RME2 are in contact with each other are notformed. The openings may be formed in the first insulating layer PAS1after the light emitting elements ED are disposed in a subsequentprocess.

Referring to FIGS. 8 and 9 , the light emitting elements ED may bedisposed on the first insulating layer PAS1. End portions (e.g.,opposite end portions) of the light emitting element ED may be disposedon the first electrode RME1 and the second electrode RME2, respectively,on the first insulating layer PAS1. In an embodiment, the light emittingelements ED may be prepared in a state in which they are dispersed inink S, and may be jetted into each sub-pixel PXn by a printing processusing an inkjet printing device. The ink S jetted through the inkjetprinting device may be seated (or disposed) in areas surrounded by thesecond bank BNL2. For example, the second bank BNL2 may prevent the inkS from overflowing into other neighboring sub-pixels PXn.

In case that the ink S including the light emitting elements ED isjetted, an electric field E may be generated by applying alignmentsignals to the respective electrodes RME1 and RME2. The light emittingelements ED dispersed in the ink S may receive a dielectrophoretic forceby the electric field E, and the light emitting elements ED receivingthe dielectrophoretic force may be seated (or disposed) on the firstinsulating layer PAS1 in case that their orientation directions andpositions are changed.

Referring to FIG. 10 , after the light emitting elements ED are disposedon the first insulating layer PAS1, the second insulating layer PAS2,the contact electrodes CNE1 and CNE2, and the third insulating layerPAS3 may be formed.

Referring to FIGS. 11 and 12 , color control members TPL, WCL1, and WCL2may be formed on the light emitting elements ED of each sub-pixel PXn.The light transmitting layer TPL may be formed on the first lightemitting elements ED1 of the first sub-pixel PX1, the first wavelengthconversion layer WCL1 may be formed on the second light emittingelements ED2 of the second sub-pixel PX2, and the second wavelengthconversion layer WCL2 may be formed on the third light emitting elementsED3 of the third sub-pixel PX3.

A process of forming the color control members TPL, WCL1, and WCL2 isnot limited. In an embodiment, the color control members TPL, WCL1, andWCL2 may be formed by an inkjet printing process or a photoresistprocess.

For example, in case that the color control members TPL, WCL1, and WCL2are formed by the photoresist process, the color control members TPL,WCL1, and WCL2 may be formed by applying the base resins BRS1, BRS2, andBRS3 in which the scatterers SCP or the wavelength conversion materialsWCP1 and WCP2 are dispersed into the areas surrounded by the second bankBNL2 and by exposing and developing the base resin BRS1, BRS2, and BRS3.For example, the base resins BRS1, BRS2, and BRS3 may be appliedrespectively to different areas of the areas surrounded by the secondbank BNL2, and different color control members TPL, WCL1, and WCL2 maybe formed for each sub-pixel PXn.

In another example, in case that the color control members TPL, WCL1,and WCL2 are formed by the inkjet printing process, the color controlmembers TPL, WCL1, and WCL2 may be formed by jetting the base resinsBRS1. BRS2, and BRS3 including the scatterers SCP or the wavelengthconversion materials WCP1 and WCP2 into the areas surrounded by thesecond bank BNL2 and by drying the base resins BRS1, BRS2, and BRS3. Forexample, the second bank BNL2 may prevent the base resins BRS1, BRS2,and BRS3 from overflowing into other neighboring sub-pixels PXn, anddifferent color control members TPL, WCL1, and WCL2 may be formed eachsub-pixel PXn. For example, a separate bank for an inkjet process of thecolor control members TPL, WCL1, and WCL2 may be further formed. Thiswill be described with reference to other embodiments.

Referring to FIG. 13 , the first capping layer CPL1 covering the colorcontrol members TPL, WCL1, and WCL2 and the second bank BNL2 may beformed on the color control members TPL, WCL1, and WCL2 and the secondbank BNL2 The first capping layer CPL1 may be formed by a process ofdepositing a material of the first capping layer CPL1 on the firstsubstrate SUB1 on which the color control members TPL, WCL1, and WCL2are disposed. The first capping layer CPL1 may surround (or cover) thecolor control members TPL, WCL1, and WCL2, and may also be disposed onportions of an upper surface of the second bank BNL2 in which the colorcontrol members TPL, WCL1, and WCL2 are not disposed.

Referring to FIG. 14 , the first light blocking member BM1 included inthe first display substrate 100 may be formed on the first capping layerCPL1. The first light blocking member BM1 may be a portion disposed onthe second bank BNL2 on the first capping layer CPL1, and may be formedin valley areas between the color control members TPL, WCL1, and WCL2.The first light blocking member BM1 may be formed by a process ofapplying a photosensitive organic material and exposing and developingthe photosensitive organic material. In case that the first displaysubstrate 100 is manufactured through the above processes, the secondsubstrate SUB2 may be prepared and the second display substrate 300 onwhich the color filter layers CFL are disposed is manufactured.

Referring to FIG. 15 , the second substrate SUB2 may be prepared, andthe second light blocking member BM2 may be formed on a surface of thesecond substrate SUB2. The second light blocking member BM2 may beformed in a lattice pattern so that portions of the surface of thesecond substrate SUB2 may be exposed. The second substrate SUB2 may bedivided into the light blocking areas BA in which the second lightblocking member BM2 is disposed and the light transmitting areas TA1.TA2, and TA3 in which a surface of the second substrate SUB2 is exposed.The second light blocking member BM2 may be formed by a process ofapplying a photosensitive organic material and exposing and developingthe photosensitive organic material, similar to the first light blockingmember BM1.

Referring to FIG. 16 , the color filter layers CFL may be formed in thelight transmitting areas TA1, TA2, and TA3 exposed without the secondlight blocking members BM2, and the second capping layer CPL2 coveringthe color filter layers CFL and the second light blocking members BM2may be formed. The first color filter layer CFL1 may be formed in thefirst light transmitting area TA1, the second color filter layer CFL2may be formed in the second light transmitting area TA2, and the thirdcolor filter layer CFL3 may be formed in the third light transmittingarea TA3. Each of the color filter layers CFL may be formed by a processof applying a photosensitive organic material including a color materialof a specific color, and exposing and developing the photosensitiveorganic material. For example, the first color filter layer CFL1 may beformed by applying a photosensitive organic material including a bluecolor material and exposing and developing the photosensitive organicmaterial, the second color filter layer CFL2 may be formed by applying aphotosensitive organic material including a green color material and byexposing and developing the photosensitive organic material, and thethird color filter layer CFL3 may be formed by applying a photosensitiveorganic material including a red color material and exposing anddeveloping the photosensitive organic material. However, embodiments arenot limited thereto.

For example, the respective color filter layers CFL1, CFL2, and CFL3 maybe spaced apart from each other on the second light blocking member BM2.However, in some embodiments, the respective color filter layers CFL1,CFL2, and CFL3 may partially overlap each other on the second lightblocking member BM2, such that any one color filter layer CFL1, CFL2, orCFL3 may be disposed on another adjacent color filter layer CFL1, CFL2,or CFL3.

A process of forming the color filter layer CFL may include a process ofapplying a photosensitive organic material and a process of exposing anddeveloping the photosensitive organic material In the processes ofmanufacturing the display device 10 according to an embodiment, aprocess of forming the color filter layers CFL on the second substrateSUB2, which is separated from the first display substrate 100 on whichthe color control members TPL, WCL1, and WCL2 are formed, may beperformed. Thus, the color control members TPL, WCL1, and WCL2 may beprotected from being damaged in an exposing and developing process.

For example, the second capping layer CPL2 covering the color filterlayers CFL and the second light blocking member BM2 may be formed. Thesecond capping layer CPL2 may be formed by depositing a material of thesecond capping layer CPL2 on the second substrate SUB2, similar to thefirst capping layer CPL1.

The second display substrate 300 may be manufactured by the aboveprocesses. In case that the first display substrate 100 and the seconddisplay substrate 300 are manufactured, the display device 10 may bemanufactured by performing a process of bonding the first displaysubstrate 100 and the second display substrate 300 to each other byusing the base layer SML.

Referring to FIG. 17 , the display device 10 may be manufactured bydisposing the base layer SML between the first display substrate 100 andthe second display substrate 300 and by bonding the first displaysubstrate 100 and the second display substrate 300 to each other. Thebase layer SML may be prepared by applying an organic material onto anyone display substrate, and may be adhered to the first display substrate100 and the second display substrate 300 in a process of bonding thefirst display substrate 100 and the second display substrate 300 to eachother A process of disposing the base layer SML on the first cappinglayer CPL1 and the first light blocking member BM1 of the first displaysubstrate 100 and a process of bonding the first display substrate 100to the second display substrate 300 are illustrated in the drawing, butembodiments are not limited thereto.

In the display device 10, the light efficiency and the color matchingrate may be improved by disposing the light emitting elements ED and thecolor control members TPL, WCL1, and WCL2 together on the firstsubstrate SUB1, and damage to the color control members TPL, WCL1, andWCL2 may be prevented by forming the color filter layers CFL on thesecond substrate SUB2.

Hereinafter, other embodiments of the display device 10 will bedescribed with reference to other drawings.

FIG. 18 is a schematic cross-sectional view illustrating a pixel of adisplay device according to an embodiment.

Referring to FIG. 18 , in a display device 10_1 according to anembodiment, a base layer SML_1 may include a low refractive material. Amaterial of the base layer SML_1 of the display device 10_1 may change,and accordingly, the display device 10_1 may further include a spacerSPC disposed between the first display substrate 100 and the seconddisplay substrate 300 to support the second display substrate 300. Thebase layer SML_1 may include the low refractive material, andaccordingly, color mixing of light emitted from neighboring sub-pixelsPXn may be prevented. Thus, the first light blocking member BM1 may beomitted. The embodiment is different from an embodiment of FIG. 4 inthat the material of the base layer SML_1 is different and the displaydevice further includes the spacer SPC. Hereinafter, a redundantdescription will be omitted for descriptive convenience, and the baselayer SML_1 and the spacer SPC will be described in detail.

The base layer SML_1 may provide an optical path of light emitted fromthe light emitting elements ED or the color control members TPL, WCL1,and WCL2, and may fill a space between the first display substrate 100and the second display substrate 300 between the first display substrate100 and the second display substrate 300. The base layer SML_1 mayinclude the low refractive material having a refractive index lower thanthat of the color control members TPL, WCL1, and WCL2 or the firstcapping layer CPL1. Thus, the occurrence of color mixing between otheradjacent sub-pixels PXn may be decreased. Light passing through thecolor control members TPL, WCL1, and WCL2 may be incident on the colorfilter layers CFL of the second display substrate 300 through the baselayer SML_1. The base layer SML_1 may include a material having a lowrefractive index, and accordingly, an amount of light incident to thecolor filter layers CFL corresponding to other sub-pixels PXn amonglight emitted from the color control members TPL, WCL1, and WCL2 ofcorresponding sub-pixels PXn may be decreased. For example, due to adifference in refractive index between the base layer SML_1 and thefirst capping layer CPL1, an amount of light totally reflected among thelight emitted from the color control members TPL, WCL1, and WCL2 may beincreased Thus, a light recycling effect may occur. For example, likethe second sub-pixel PX2 and the third sub-pixel PX3, some of lightemitted from the second light emitting elements ED2 and the third lightemitting elements ED3 may be emitted from the wavelength conversionlayers WCL1 and WCL2 without a change in color. The base layer SML_1 mayinclude the low refractive material, and accordingly, an amount of lightemitted and recycled from the wavelength conversion layers WCL1 and WCL2may be increased and light efficiency and color purity may be furtherimproved.

The spacer SPC may be disposed in order to prevent the second displaysubstrate 300 from sagging (or bending) due to the change in thematerial of the base layer SML_1. According to an embodiment, the spacerSPC may overlap the second bank BNL2 of the first display substrate 100or the second light blocking member BM2 of the second display substrate300 in the thickness direction. For example, the first light blockingmember BM1 may be omitted. Thus, the spacer SPC may be disposed in thevalley areas between the color control members TPL, WCL1, and WCL2 onthe first capping layer CPL1. A lower surface of the spacer SPC may bein contact with the first capping layer CPL1, and an upper surface ofthe spacer SPC may be in contact with the second capping layer CPL2 Thespacer SPC may prevent the second display substrate 300 from partiallysagging (or partially bending) due to the base layer SML_1 including thelow refractive material, and may maintain a distance between the firstdisplay substrate 100 and the second display substrate 300.

Unlike the first light blocking member BML, the spacer SPC may not bedisposed at each of the boundary areas between the respective sub-pixelPXn, but may be disposed at every plural sub-pixels PXn. As an example,the spacer SPC may be disposed at every three sub-pixels PXn or a singlepixel PX. The spacer SPC may be disposed in valley portions of the colorcontrol members TPL, WCL1, and WCL2 at the boundary areas between thepixels PX in plan view. The spacer SPC may be made of an organicmaterial, an inorganic material, or the like. For example, the spacerSPC may be made of an organic material such as a photoresist, apolyacrylic resin, a polyimide resin, or an acrylic resin.

As the color control members TPL, WCL1, and WCL2 are disposed adjacentto the light emitting elements ED, most of the light emitted from thelight emitting elements ED may be incident. Thus, light efficiency maybe improved. For example, as the wavelength conversion layers WCL1 andWCL2 are disposed adjacent to the light emitting elements ED emittingthe light of the first color, light conversion efficiency may beimproved, and emission of light of colors other than a desired color maybe prevented. However, in a case of the light transmitting layer TPL,even though the light transmitting layer TPL is not disposed adjacent tothe light emitting elements ED, light conversion efficiency may not beconsidered. For example, even though a distance between the lighttransmitting layer TPL and the light emitting elements ED is great,light efficiency, a color matching rate, and the like, may be excellentin the corresponding sub-pixel PXn. According to an embodiment, thelight transmitting layer TPL may be disposed on a surface of the seconddisplay substrate 300 rather than the first display substrate 100, andthe base layer SML may be disposed on the light emitting elements ED inthe first sub-pixel PX1 of the first display substrate 100.

FIG. 19 is a schematic cross-sectional view illustrating a pixel of adisplay device according to an embodiment. FIGS. 20 to 22 arecross-sectional views sequentially illustrating some of processes ofmanufacturing the display device of FIG. 19 . FIGS. 20 to 22 illustratea process of forming color control members TPL_2, WCL1, and WCL2 and aprocess of bonding a first display substrate 100_2 and a second displaysubstrate 300_2 to each other.

Referring to FIGS. 19 to 22 , in a display device 10 according to anembodiment, a light transmitting layer TPL_2 may be disposed on asurface of the second display substrate 300_2. The light transmittinglayer TPL_2 may be disposed on a surface of the first color filter layerCFL1 facing the first substrate SUB1, which is disposed in the firstlight transmitting area TA1 The light transmitting layer TPL_2 may notbe disposed in a light emitting area EMA corresponding to a firstsub-pixel PX1 of the first display substrate 100_2, and may be spacedapart from the first display substrate 100_2 by the base layer SML. Inthe first sub-pixel PX1, the base layer SML may be disposed (e.g.,directly disposed) in an area surrounded by the second bank BNL2. Theembodiment is different from an embodiment of FIG. 4 in the displaysubstrates 100_2 and 300_2 on which the light transmitting layer TPL_2is disposed Hereinafter, a redundant description will be omitted fordescriptive convenience, and contents different from those describedabove will be described.

As in an embodiment of FIG. 4 , the wavelength conversion layers WCL1and WCL2 may be disposed in light emitting areas EMA of a secondsub-pixel PX2 and a third sub-pixel PX3 of sub-pixels PXn of the firstdisplay substrate 100_2, respectively. For example, the lighttransmitting layer TPL_2 may not be disposed in the light emitting areaEMA of the first sub-pixel PX1. In the process of forming the colorcontrol members TPL, WCL1, and WCL2 of the first display substrate100_2, the first wavelength conversion layer WCL1 and the secondwavelength conversion layer WCL2 may be formed, and the lighttransmitting layer TPL_2 may not be formed. The first capping layer CPL1may surround the wavelength conversion layers WCL1 and WCL2, but may notbe disposed on the first sub-pixel PX1. The first capping layer CPL1 maybe partially disposed on the second bank BNL2 at a boundary area withthe first sub-pixel PX1.

A first light blocking member BM1 disposed at a boundary area betweenthe first sub-pixel PX1 and another adjacent sub-pixel PXn may bepartially disposed in the light emitting area EMA of the first sub-pixelPX1 Since the light transmitting layer TPL_2 is not disposed in thelight emitting area EMA of the first sub-pixel PX1, the first lightblocking member BM1 may be disposed (e.g., directly disposed) on thefirst insulating layer PAS1 of the first sub-pixel PX1. For example, thebase layer SML may be disposed in an area in which the lighttransmitting layer TPL_2 is not disposed. The base layer SML may be incontact with (e.g., in direct contact with) some of the insulatinglayers PAS1, PAS2, and PAS3 on the first light emitting elements ED1.

The light transmitting layer TPL_2 may be disposed on the second displaysubstrate 300_2. The light transmitting layer TPL_2 may be disposed inthe first light transmitting area TA1 corresponding to the firstsub-pixel PX1, and may be disposed on a surface of the first colorfilter layer CFL1, e.g., a surface of the first color filter layer CFL1facing the first substrate SUB1. In an embodiment, the second cappinglayer CPL2 may be disposed between the first color filter layer CFL1 andthe light transmitting layer TPL_2, and the light transmitting layerTPL_2 may be disposed (e.g., directly disposed) on a surface of thesecond capping layer CPL2. The second display substrate 300_2 mayfurther include a third capping layer CPL3 for protecting the lighttransmitting layer TPL_2, and the third capping layer CPL3 may bedisposed on the light transmitting layer TPL_2 so as to correspond tothe first light transmitting area TA1. During processes of manufacturingthe second display substrate 300_2, a process of forming the lighttransmitting layer TPL_2 in the first light transmitting area TA1 may befurther performed after the second capping layer CPL2 is formed. In anembodiment, the light transmitting layer TPL_2 may also be formed by aphotoresist process, and even though separate second banks BNL2 are notdisposed in light blocking areas BA of the second display substrate3002, the light transmitting layer TPL_2 may be selectively formed inthe first light transmitting area TA1.

The first display substrate 100_2, on which the light transmitting layerTPL_2 is not formed, may be bonded to the second display substrate300_2, on which the light transmitting layer TPL_2 is formed, throughthe base layer SML. Since the base layer SML includes the organicmaterial, even though a step is formed by the light transmitting layerTPL_2 of the second display substrate 300_2, the first display substrate100_2 and the second display substrate 300_2 may be smoothly bonded toeach other.

FIG. 23 is a schematic plan view illustrating a pixel of a first displaysubstrate according to an embodiment. FIG. 24 is a schematic plan viewillustrating a pixel of a first display substrate according to anembodiment.

Referring to FIGS. 23 and 24 , in a display device 10, areas of a firstsub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3displaying different colors may be different from each other In a seconddisplay substrate 300_3, light may be emitted to a surface of a secondsubstrate SUB2, and at the same time, external light may be incident onthe surface of the second substrate SUB2. Light incident from theoutside may be reflected and emitted to the surface of the secondsubstrate SUB2, and the reflected external light may be recognized by auser and may decrease display quality due to vision hindrance (or visioninterruption). In order to improve the display quality of the displaydevice 10, areas of color filter layers CFL of the second displaysubstrate 300_3 of the display device 10 may be different from eachother according to color materials included in the color filter layersCFL. Thus, areas of light emitting areas EMA of a first displaysubstrate 100_3 may be different from each other.

For example, a third color filter layer CFL3 including a red colormaterial may be disposed in the third sub-pixel PX3, and a third lighttransmitting area TA3 of the third sub-pixel PX3 may have an areagreater than those of a first light transmitting area TA1 and a secondlight transmitting area TA2. For example, a second color filter layerCFL2 including a green color material may be disposed in the secondsub-pixel PX2, and the second light transmitting area TA2 of the secondsub-pixel PX2 may have an area greater than that of the first lighttransmitting area TAL. For example, in the first display substrate100_3, an area of a light emitting area EMA of the third sub-pixel PX3may be greater than areas of light emitting areas EMA of the secondsub-pixel PX2 and the first sub-pixel PX1, and an area of the lightemitting area EMA of the second sub-pixel PX2 may be greater than anarea of the light emitting area EMA of the first sub-pixel PX1. It isillustrated in FIGS. 23 and 24 that the area of the third sub-pixel PX3in which the third color filter layer CFL3 including the red colormaterial is disposed is the greatest, but embodiments are not limitedthereto. In some embodiments, the area of the second sub-pixel PX2 orthe first sub-pixel PX1 may be the greatest. In an embodiment, bydesigning the areas of the respective sub-pixels PXn to be differentfrom each other, deterioration of display quality due to external lightreflection of the display device 10 may be prevented.

As described above, in the display device 10 according to an embodiment,the color control members TPL, WCL1, and WCL2 may be formed by an inkjetprinting process. The color control members TPL, WCL1, and WCL2 may beformed by a process of jetting ink for forming the color control membersTPL, WCL1, and WCL2 into the areas surrounded by the second bank BNL2and a process of drying the ink In some embodiments, an inkjet printingprocess for forming the color control members TPL, WCL1, and WCL2 may beperformed after other banks disposed on the second bank BNL2 are furtherformed. Accordingly, the first light blocking member BM1 may be omittedfrom the manufactured display device 10, and the manufactured displaydevice 10 may further include other banks.

FIG. 25 is a schematic cross-sectional view illustrating a pixel of adisplay device according to an embodiment.

Referring to FIG. 25 , a display device 104 according to an embodimentfurther may include a third bank BNL3_4 disposed on the second bankBNL2, and the color control members TPL, WCL1, and WCL2 may be disposedin areas surrounded by the second bank BNL2 and the third bank BNL3_4.The third bank BNL3_4 may prevent jetted ink from overflowing into otherneighboring sub-pixels PXn in an inkjet process for forming the colorcontrol members TPL, WCL1, and WCL2. The display device 10_4 of FIG. 25is different from the display device according to the above-describedembodiment in that it further includes the third bank BNL3_4 disposed onthe second bank BNL2. Thus, the color control members TPL, WCL1, andWCL2 may be formed by an inkjet printing process. Hereinafter, redundantcontents will be omitted for descriptive convenience, and contentsdifferent from those described above will be described.

The third bank BNL3_4 may be disposed (e.g., directly disposed) on thesecond bank BNL2. The third bank BNL3_4 may extend in the firstdirection DR1 and the second direction DR2, similar to the second bankBNL2 in plan view, and may be disposed at boundary areas between therespective sub-pixels PXn. A width of a lower surface of the third bankBNL3_4 may be smaller than a width of an upper surface of the secondbank BNL2. Side surfaces (e.g., opposite side surfaces) of the thirdbank BNL3_4 may be recessed inward as compared with side surfaces of thesecond bank BNL2 in cross-sectional view. However, embodiments are notlimited thereto, and a width of the lower surface of the third bankBNL3_4 may be substantially the same as a width of the upper surface ofthe second bank BNL2. Thus, the side surfaces of the third bank BNL3_4may be parallel to the side surfaces of the second bank BNL2.

In an embodiment, a height (or a thickness) of the third bank BNL3_4 maybe smaller than that of the second bank BNL2. The third bank BNL3_4 mayprevent the ink for forming the color control members TPL, WCL1, andWCL2 from overflowing, together with the second bank BNL2. Since the inkis jetted into the areas surrounded by the second bank BNL2, overflow ofa certain amount of ink may be prevented by the second bank BNL2. Thethird bank BNL3_4 may have a height enough for jetted ink not tooverflow in case that an amount of ink greater than an amount of ink,which is confined by the second bank BNL2, is jetted. For example, theheight of the third bank BNL3_4 may change according to heights of thecolor control members TPL, WCL1, and WCL2.

The third bank BNL3_4 and the second bank BNL2 may include the samematerial. The third bank BNL3_4 and the second bank BNL2 may be formedin the same manner except for its shape. However, embodiments are notlimited thereto, and in some embodiments, the third bank BNL3_4 and thefirst light blocking member BM1 may include the same material such thatlight emitted from light emitting elements ED of neighboring sub-pixelsPXn may be blocked from transmitting toward other sub-pixels PXn.Accordingly, the first light blocking member BM1 may be omitted.

For example, side surfaces and at least a portion of an upper surface ofthe third bank BNL3_4 may be treated by a liquid repellent treatment.During processes of manufacturing the display device 10_4, the sidesurfaces and the upper surface or at least a portion of the uppersurface of the third bank BNL3_4 may be treated by the liquid repellenttreatment. Thus, overflow of ink may be effectively prevented.

The color control members TPL, WCL1, and WCL2 may be disposed in lightemitting areas EMA among the areas surrounded by the second bank BNL2and the third bank BNL3_4. In some embodiments, a height of the colorcontrol members TPL, WCL1, and WCL2 may be greater than a height of thethird bank BNL3_4. The color control members TPL, WCL1, and WCL2 formedby the inkjet printing process may be formed by drying the ink jettedinto each sub-pixel PXn. In a process of drying the ink, the colorcontrol members TPL, WCL1, and WCL2 may be formed at a greater height inportions in contact with the third bank BNL3_4 positioned at boundaryareas with neighboring sub-pixels PXn, and may be formed at a relativelysmall height in central portions of the sub-pixels PXn spaced apart fromthe third bank BNL3_4. However, embodiments are not limited thereto, anda height of the color control members TPL, WCL1, and WCL2 may besubstantially the same as a height of the third bank BNL3_4, and thecolor control members TPL, WCL1, and WCL2 may be formed so that uppersurfaces thereof may be parallel to the upper surface of the third bankBNL3_4.

A first capping layer CPL1_4 may be disposed on the color controlmembers TPL, WCL1, and WCL2 and the third bank BNL3_4. Unlike anembodiment of FIG. 4 , the first capping layer CPL1_4 may cover thethird bank BNL3_4, and a portion of a lower surface of the first cappinglayer CPL1_4 may be in contact with (e.g., in direct contact with) thethird bank BNL3_4.

FIGS. 26 and 27 are schematic cross-sectional views sequentiallyillustrating some of processes of manufacturing the display device ofFIG. 25 .

Referring to FIGS. 26 and 27 , processes of manufacturing the displaydevice 10_4 may further include forming the third bank BNL3_4 on thesecond bank BNL2. The third bank BNL3_4 may be formed on the second bankBNL2 in a process before the light emitting elements ED are disposed orbe formed on the second bank BNL2 in a process after the second contactelectrode CNE2 is formed. In case that a process of forming the thirdbank BNL3_4 is performed before the inkjet printing process for formingthe color control members TPL, WCL1, and WCL2, the order of the processis not limited.

The color control members TPL, WCL1, and WCL2 may be formed in the areassurrounded by the second bank BNL2 and the third bank BNL3_4 through theinkjet printing process. The inkjet printing process may be performed ina manner of jetting the base resins BRS1, BRS2, and BRS3 including thescatterers SCP or the wavelength conversion material WCP1 and WCP2. Inaddition to the second bank BNL2, the third bank BNL3_4 may prevent thebase resins BRS1, BRS2, and BRS3 from overflowing into other neighboringsub-pixels PXn. As described above, in case that the side surfaces andthe upper surface of the third bank BNL3_4 are subjected to the liquidrepellent treatment, the overflow of the base resins BRS1, BRS2, andBRS3 may be more effectively prevented. For example, different colorcontrol members TPL, WCL1, and WCL2 may be formed for each sub-pixel PXnby drying the base resins BRS1. BRS2, and BRS3. In an embodiment, thedisplay device 10_4 may further include the third banks BNL3_4, suchthat the inkjet printing process may be performed as a process offorming the color control members TPL, WCL1, and WCL2, and the displaydevice 10 having the same effects as embodiments may be manufactured byvarious process methods.

FIGS. 28 and 29 are schematic cross-sectional views illustrating a pixelof a display device according to an embodiment.

Referring to FIGS. 28 and 29 , in display devices 10_5 and 10_6according to an embodiment, a portion of the first color filter layerCFL1 may be disposed in the light blocking area BA or a color patternlayer CFP including the same color material as that of the first colorfilter layer CFL1 may be disposed in the light blocking area BA. In thelight blocking areas BA, color filter layers CFL1, CFL2, and CFL3 mayoverlap each other or at least one of the color pattern layer CFP, thesecond color filter layer CFL2, and the third color filter layer CFL3may overlap each other. The color filter layers CFL1, CFL2, and CFL3 mayinclude dyes of different colors, respectively, and as the color filterlayers CFL1, CFL2, and CFL3 are stacked, transmission of light may beblocked. In the display device 10_5 of FIG. 28 , the second lightblocking member BM2 may be disposed on the first color filter layer CFL1or the color pattern layer CFP disposed in the light blocking area BA,and in the display device 10_6 of FIG. 29 , the second light blockingmember BM2 is omitted, and at least one of the second color filter layerCFL2 and the third color filter layer CFL3 may overlap the first colorfilter layer CFL1 or the color pattern layer CFP. An embodiment of FIG.29 is different from an embodiment of FIG. 28 in that the second lightblocking member BM2 is omitted. Hereinafter, a configuration of anembodiment of FIG. 28 will be described.

The first color filter layer CFL1 (or the color pattern layer CFP) maybe disposed in the light blocking area BA of the second substrate SUB2.The first color filter layer CFL1 may be disposed in a portion of thelight blocking area BA as well as above the light transmitting layer TPLso as to correspond to the first sub-pixel PX1. For example, in thelight blocking area BA adjacent to the first light transmitting areaTA1, the first color filter layer CFL1 may extend to have a greaterwidth. The color pattern layer CFP may be disposed in the light blockingareas BA adjacent to the second light transmitting area TA2 and thethird light transmitting area TA3 The color pattern layer CFP and thefirst color filter layer CFL1 may include the same material. The colorpattern layer CFP may be formed together with the first color filterlayer CFL1 in a single process.

The second light blocking member BM2 may be disposed on the first colorfilter layer CFL1 (or the color pattern layer CFP) disposed in the lightblocking area BA. The second light blocking member BM2 may be disposedin the same manner as that of an embodiment of FIG. 4 except that thesecond light blocking member BM2 is disposed in the light blocking areaBA of the second substrate SUB2 with the first color filter layer CFL1(or the color pattern layer CFP) interposed therebetween.

At least one of the second color filter layer CFL2 and the third colorfilter layer CFL3 may be disposed on the first color filter layer CFL1or the color pattern layer CFP disposed in the light blocking area BA.The second color filter layer CFL2 and the third color filter layer CFL3may include dyes having colors different from that of the first colorfilter layer CFL1, respectively, and accordingly, transmission of lightmay be blocked in portions in which the second color filter layer CFL2and the third color filter layer CFL3 are stacked.

In an embodiment in which the first color filter layer CFL1 includes ablue color material, external light or reflected light transmittedthrough the light blocking area BA may have a blue wavelength band. Aneye color sensibility perceived by user's eyes may be differentaccording to a color of light, and light of a blue wavelength band maybe perceived less sensitively by a user than light of a green wavelengthband and light of a red wavelength band. By stacking and displaying thecolor filter layers CFL1, CFL2, and CFL3 or the color pattern layer CFPin the light blocking areas BA, the user may perceive the reflectedlight relatively less sensitively with blocking transmission of thelight, and to absorb some of light introduced from the outside of thedisplay devices 10_5 and 10_6 to reduce the reflected light by theexternal light.

In concluding the detailed description, those skilled in the art willappreciate that many variations and modifications can be made to theembodiments without substantially departing from the principles of theinvention. Therefore, the disclosed embodiments of the invention areused in a generic and descriptive sense only and not for purposes oflimitation.

1. A display device comprising: a first substrate including a pluralityof sub-pixels including light emitting areas; a plurality of firstelectrodes and a plurality of second electrodes disposed on the firstsubstrate and spaced apart from each other; a plurality of lightemitting elements disposed on the first substrate and disposed on theplurality of first electrodes and the plurality of second electrodes inthe light emitting areas of the plurality of sub-pixels; a color controlmember disposed on the plurality of light emitting elements andincluding a plurality of light transmitting layers and a plurality ofwavelength conversion layers; a second substrate facing the firstsubstrate and including a plurality of light transmitting areasoverlapping the plurality of sub-pixels; a plurality of color filterlayers disposed on a surface of the second substrate facing the firstsubstrate; and a base layer disposed between the first substrate and thesecond substrate and disposed between at least the plurality ofwavelength conversion layers and the plurality of color filter layers.2. The display device of claim 1, wherein the plurality of lightemitting elements include first light emitting elements disposed in afirst sub-pixel and second light emitting elements disposed in a secondsub-pixel, the color control member includes a light transmitting layerdisposed on the first light emitting elements and a first wavelengthconversion layer disposed on the second light emitting elements, and theplurality of color filter layers include a first color filter layerdisposed on the light transmitting layer and a second color filter layerdisposed on the first wavelength conversion layer.
 3. The display deviceof claim 2, wherein the light transmitting layer is directly disposed onthe first light emitting elements, the first wavelength conversion layeris directly disposed on the second light emitting elements, and the baselayer is disposed between the light transmitting layer and the firstcolor filter layer.
 4. The display device of claim 2, furthercomprising: a first capping layer disposed on the light transmittinglayer and the first wavelength conversion layer; and a second cappinglayer disposed on a surface of the first color filter layer facing thefirst substrate and a surface of the second color filter layer facingthe first substrate, wherein the base layer is in direct contact withthe first capping layer and the second capping layer.
 5. The displaydevice of claim 4, further comprising: a spacer disposed at a boundaryarea between some of the plurality of sub-pixels and disposed betweenthe first substrate and the second substrate, wherein the base layerincludes a low refractive material having a refractive index lower thana refractive index of the first capping layer.
 6. The display device ofclaim 5, wherein the spacer is in direct contact with the first cappinglayer and the second capping layer.
 7. The display device of claim 2,wherein the light transmitting layer is disposed on a surface of thefirst color filter layer facing the first substrate, and the base layeris disposed between the light transmitting layer and the first lightemitting elements.
 8. The display device of claim 7, further comprisinga third capping layer disposed on a surface of the light transmittinglayer facing the first substrate.
 9. The display device of claim 2,wherein the plurality of light emitting elements emit light of a firstcolor, and the first wavelength conversion layer converts the light ofthe first color emitted from the plurality of light emitting elementsinto light of a second color different from the first color.
 10. Thedisplay device of claim 9, wherein the plurality of light emittingelements further include third light emitting elements disposed in athird sub-pixel, the color control member further includes a secondwavelength conversion layer directly disposed on the third lightemitting elements, the color filter layers further include a third colorfilter layer disposed on the second wavelength conversion layer, and thesecond wavelength conversion layer converts the light emitted from thethird . . . light emitting elements into light of a third colordifferent from the first color and the second color.
 11. The displaydevice of claim 1, further comprising: a plurality of first banksdisposed boundary areas between the plurality of sub-pixels and disposedand spaced apart from each other in the light emitting areas; and asecond bank disposed at the boundary areas between the plurality ofsub-pixels and partially disposed on the plurality of first banks,wherein the plurality of first electrodes and the plurality of secondelectrodes are disposed on different first banks, respectively.
 12. Thedisplay device of claim 11, further comprising: a first light blockingmember disposed between the plurality of light transmitting layers andthe plurality of wavelength conversion layers; and a second lightblocking member disposed on the surface of the second substrate anddisposed between the plurality of color filter layers, wherein the firstlight blocking member and the second light blocking member overlap thesecond bank in a thickness direction.
 13. The display device of claim11, further comprising: a third bank disposed on the second bank; and afirst capping layer disposed on the third bank and the color controlmember.
 14. The display device of claim 11, further comprising: a firstinsulating layer disposed on the plurality of first electrodes and theplurality of second electrodes; a first contact electrode in contactwith end portions of the plurality of light emitting elements and theplurality of first electrodes; and a second contact electrode in contactwith other end portions of the plurality of light emitting elements andthe plurality of second electrodes, wherein the plurality of lightemitting elements are directly disposed on the first insulating layer.15. A display device comprising: a first substrate including a pluralityof sub-pixels including light emitting areas the plurality of sub-pixelsincluding a first sub-pixel and a second sub-pixel; a first electrodeand a second electrodes disposed in each of the plurality of sub-pixelson the first substrate and spaced apart from each other; first lightemitting elements disposed on the first electrode and the secondelectrode of the first sub-pixel and second light emitting elementsdisposed on the first electrode and the second electrode of the secondsub-pixel; a light transmitting layer directly disposed on the firstlight emitting elements and a first wavelength conversion layer directlydisposed on the second light emitting elements; a first capping layercovering the light transmitting layer and the first wavelengthconversion layer; a second substrate facing the first substrate andincluding a first light transmitting area overlapping the firstsub-pixel and a second light transmitting area overlapping the secondsub-pixel; a first light blocking member disposed on a surface of thesecond substrate facing the first substrate and disposed between thefirst light transmitting area and the second light transmitting area; afirst color filter layer disposed on the surface of the second substratein the first light transmitting area and a second color filter layerdisposed on the surface of the second substrate in the second lighttransmitting area; a second capping layer covering the first colorfilter layer, the second color filter layer, and the light blockingmember; and a base layer disposed between the first capping layer andthe second capping layer.
 16. The display device of claim 15, furthercomprising: a plurality of first banks disposed in adjacent sub-pixelson the first substrate and spaced apart from each other in the lightemitting areas; and a second bank disposed at a boundary area betweenthe adjacent sub-pixels and surrounding the light emitting areas,wherein the light transmitting layer and the first wavelength conversionlayer are disposed in areas surrounded by the second bank.
 17. Thedisplay device of claim 16, wherein the first capping layer is directlydisposed on the second bank.
 18. The display device of claim 17, furthercomprising a second light blocking member directly disposed on a portionof the first capping layer disposed on the second bank and disposedbetween the light transmitting layer and the first wavelength conversionlayer.
 19. The display device of claim 16, wherein the second bank andthe first light blocking member overlap each other in a thicknessdirection.
 20. The display device of claim 16, further comprising: aspacer disposed at a boundary area between some of the plurality ofsub-pixels and disposed to be in direct contact with the first cappinglayer and the second capping layer between the first substrate and thesecond substrate, wherein the base layer includes a low refractivematerial having a refractive index lower than a refractive index of thefirst capping layer.